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參數(shù)資料
| 型號： | BT151X-800R |
| 廠商： | NXP Semiconductors N.V. |
| 元件分類： | 參考電壓二極管 |
| 英文描述： | Thyristor |
| 封裝： | BT151X-800R<SOT186A (SOT186A)|<<http://www.nxp.com/packages/SOT186A.html<1<week 32, 2004,;BT151X-800R/DG<SOT186A (SOT186A)|<<http://www.nxp.com/packages/SOT186A.html<1 |
| 文件頁數(shù)： | 5/15頁 |
| 文件大小： | 107K |
| 代理商： | BT151X-800R |
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2.3
2.3
1.6 x 3
4.8
4.2
3.0
2.54
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Fig. 5. Universal SOT223 / SOT428 pad layout.
Fig. 6. SOT428 & SOT223 relative sizes.
SOT428 soldering
This surface mount package features a relatively
large solder area (compared to SOT223) which is
hidden after assembly. Because the mating surfaces
between the main PCB pad and the device are
remote from the outside world, wave soldering
cannot be relied upon to wet the joint sufficiently. It is
therefore necessary to use a reflow soldering method
for packages of this design. Figure 7 shows the
SOT428 solder pad dimensions.
SOT428 design features for surface mountability
It is well known among power semiconductor
manufacturers that the larger a surface mounted
power semiconductors is, the more vulnerable it is to
die stresses during manufacture and during the
surface mounting process. This can result in a
significant percentage of rejects due to die cracking.
We have learned long ago that it is not possible to
use the same manufacturing techniques for surface
mount devices as are used for through-hole devices.
Unacceptable failure rates will certainly be the result,
either during manufacture, during surface mounting
or during prolonged thermal cycling in the
application.
Philips Semiconductors has spent a long time
perfecting its SOT428 package before releasing it
onto the market so that these pitfalls can be avoided.
Described below are some of the special design
features which ensure successful manufacture and
longterm reliable operation in the customer’s
application.
7.0
7.0
2.15
2.5
4.57
1.5
Fig. 7. SOT428 solder pad dimensions.
1. The package is moulded using a low stress
epoxy plastic in order to minimise the bending
force on the mounting base as curing takes place.
Less bending of the mounting base means less
die stress.
2. A thick copper mounting base of 0.89mm (0.035
inches) max thickness is used to further inhibit
any tendency for bending of the mounting base.
3. A low stress, high lead content soft solder is used
for diebonding. The amount of “give” in the solder
accommodates
differential
minimises die stress.
expansions
and
4. A new technique has been developed to
accurately control the thickness and positioning of
the die-attach solder on the diepad. This
guarantees
optimum
complete die area every time without unsoldered
areas or excess solder. The benefit of this is to
offer the best longterm reliability under thermal
stress and the minimum junction-to-mounting
base thermal resistance.
diebonding
over
the
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| BT151X-800R,127 | 功能描述:SCR SCR RoHS:否 制造商:STMicroelectronics 最大轉(zhuǎn)折電流 IBO:480 A 額定重復(fù)關(guān)閉狀態(tài)電壓 VDRM:600 V 關(guān)閉狀態(tài)漏泄電流（在 VDRM IDRM 下）:5 uA 開啟狀態(tài) RMS 電流 (It RMS): 正向電壓下降:1.6 V 柵觸發(fā)電壓 (Vgt):1.3 V 最大柵極峰值反向電壓:5 V 柵觸發(fā)電流 (Igt):35 mA 保持電流（Ih 最大值）:75 mA 安裝風(fēng)格:Through Hole 封裝 / 箱體:TO-220 封裝:Tube |
| BT151X-800R/DG | 制造商:NXP Semiconductors 功能描述:Tube 制造商:NXP Semiconductors 功能描述:Thyristor SCR 800V 132A 3-Pin(3+Tab) TO-220F |
| BT151X-800R/DG,127 | 功能描述:SCR THYRISTOR RoHS:否 制造商:STMicroelectronics 最大轉(zhuǎn)折電流 IBO:480 A 額定重復(fù)關(guān)閉狀態(tài)電壓 VDRM:600 V 關(guān)閉狀態(tài)漏泄電流（在 VDRM IDRM 下）:5 uA 開啟狀態(tài) RMS 電流 (It RMS): 正向電壓下降:1.6 V 柵觸發(fā)電壓 (Vgt):1.3 V 最大柵極峰值反向電壓:5 V 柵觸發(fā)電流 (Igt):35 mA 保持電流（Ih 最大值）:75 mA 安裝風(fēng)格:Through Hole 封裝 / 箱體:TO-220 封裝:Tube |
| BT151XSERIES | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Thyristors |
| BT152 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Thyristors |
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