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參數(shù)資料
| 型號(hào)： | BGY1916 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 衰減器 |
| 英文描述： | UHF amplifier module |
| 中文描述： | 1930 MHz - 1990 MHz RF/MICROWAVE NARROW BAND HIGH POWER AMPLIFIER |
| 封裝： | PLASTIC, SOT365A, 4 PIN |
| 文件頁(yè)數(shù)： | 6/12頁(yè) |
| 文件大?。?/td> | 84K |
| 代理商： | BGY1916 |
1998 May 27
6
Philips Semiconductors
Product specification
UHF amplifier module
BGY1916
MOUNTING RECOMMENDATIONS
To ensure a good thermal contact and to prevent mechanical stress when bolted down, the flatness of the mounting base
is designed to be typically better than 0.1 mm. The mounting area of the heatsink should be flat and free from burrs and
loose particles. The heatsink should be rigid and not prone to bowing under thermal cycling conditions. The thickness of
a solid heatsink should be not less than 5 mm to ensure a rigid assembly.
A thin, even layer of thermal compound should be applied between the mounting base and the heatsink to achieve the
best possible thermal contact resistance. Excessive use of thermal compound will result in an increase in thermal
resistance and possible bowing of the mounting base; too little will also result in poor thermal conduction.
The module should be mounted to the heatsink using 3 mm bolts with flat washers. The bolts should first be tightened to
“finger tight” and then further tightened in alternating steps to a maximum torque of 0.4 to 0.6 Nm.
Once the module is mounted on the heatsink, the leads can be soldered to the printed-circuit board. A soldering iron may
be used up to a temperature of 250
°
C for a maximum of 10 seconds at a distance of 2 mm from the plastic cap.
Precautions must be taken to protect the device from electrostatic damage (ESD).
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相關(guān)代理商/技術(shù)參數(shù) |
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| BGY200 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:RF Amplifier |
| BGY2016 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:UHF amplifier module |
| BGY2016,127 | 功能描述:射頻放大器 RAIL TNS-RFPR RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點(diǎn):37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測(cè)試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| BGY204 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:UHF amplifier module |
| BGY205 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:UHF amplifier module |
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