參數(shù)資料
型號: BGF944
廠商: NXP SEMICONDUCTORS
元件分類: 衰減器
英文描述: GSM900 EDGE power module
中文描述: 920 MHz - 960 MHz RF/MICROWAVE NARROW BAND HIGH POWER AMPLIFIER
封裝: PLASTIC, SOT-365C, 3 PIN
文件頁數(shù): 3/12頁
文件大?。?/td> 91K
代理商: BGF944
2003 Jun 06
3
Philips Semiconductors
Product specification
GSM900 EDGE power module
BGF944
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
CHARACTERISTICS
T
mb
= 25
°
C; V
S
= 26 V; P
L
= 2.5 W; f = 920 to 960 MHz; Z
S
= Z
L
= 50
;
unless otherwise specified.
Note
1.
G
Pi
is small signal in-band gain.
SYMBOL
PARAMETER
MIN.
MAX.
UNIT
V
S
P
D
P
L
T
stg
T
mb
DC supply voltage
input drive power
load power
storage temperature
operating mounting base temperature
30
20
30
100
24
+100
+90
V
mW
W
°
C
°
C
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
I
DQ
P
1dB
G
p
G
p freq
quiescent current (pin 2)
load power
power gain
gain flatness over frequency
range
gain flatness over power band P
L
= 25 mW up to 2.5 W
out of band gain
P
D
= 0 mW
at 1 dB gain compression
13
27
280
17
29
0.2
320
31
1
mA
W
dB
dB
G
p pwr
G
OB
0.8
0.2
+0.2
G
Pimax
+ 1
note 1
2 : 1
60
dB
dB
small signal, P
D
= 0 dBm;
f < 920 MHz, f > 960 MHz
VSWR
in
IMD
r
input VSWR
reverse intermodulation
1.6 : 1
66
f
i
= f
c
±
200 kHz;
P
carrier
= 2.5 W;
P
interference
=
40 dBc;
dBc
H
2
H
3
second harmonic
third harmonic
stability
all spurious outputs more than 60 dB
below desired signal
no degradation in output power
38
61
35
58
dBc
dBc
VSWR
3 : 1 through all
phases; V
S2
= 25 to 28 V
VSWR = 10 : 1 through all
phases; P
L
= 5 W
ruggedness
EDGE
(P
L
= 2.5 W average)
η
efficiency
SR200
spectral regrowth;
EDGE GSM signal
SR400
EVM
rms
rms EDGE signal distortion
EVM
M
peak EDGE signal distortion
Intermodulation distortion
(P
L
= 2.5 W average)
12
15
36
65
0.4
1.2
35
63
1.2
4
%
dBc
dBc
%
%
200 kHz
400 kHz
d
3
d
5
d
7
third order intermodulation
fifth order intermodulation
seventh order intermodulation
carrier spacing = 200 kHz
45
52
60
40
dBc
dBc
dBc
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