參數(shù)資料
型號: BCX56
廠商: CENTRAL SEMICONDUCTOR CORP
元件分類: 功率晶體管
英文描述: SURFACE MOUNT NPN SILICON TRANSISTOR
中文描述: 1 A, 80 V, NPN, Si, POWER TRANSISTOR
封裝: PLASTIC PACKAGE-3
文件頁數(shù): 3/4頁
文件大?。?/td> 83K
代理商: BCX56
BCX56–10R1
http://onsemi.com
3
TYPICAL ELECTRICAL CHARACTERISTICS
I
C
, COLLECTOR CURRENT (mA)
Figure 2. Current-Gain – Bandwidth Product
f
T
1000
100
10
100
10
1.0
1000
C
80
60
40
20
10
8.0
6.0
4.0
V
R
, REVERSE VOLTAGE (VOLTS)
Figure 3. Capacitance
0.1
0.2
0.5
1.0
2.0
5.0
10
20
50
100
I
C
, COLLECTOR CURRENT (mA)
Figure 4. “On” Voltages
1.0
0.4
0
100
1.0
0.5
500
1.0
0.8
0.6
0.4
0.2
0
0.05
I
C
, COLLECTOR CURRENT (mA)
Figure 5. Collector Saturation Region
0.1
0.2
0.5
2.0
5.0
10
20
50
V
V
0.8
0.6
0.2
2.0
5.0
10
20
50
200
1.0
V
BE(on)
@ V
CE
= 1.0 V
V
CE(sat)
@ I
C
/I
B
= 10
V
BE(sat)
@ I
C
/I
B
= 10
T
J
= 25
°
C
50
mA
100mA
T
J
= 25
°
C
250mA
500mA
I
C
= 10mA
T
J
= 25
°
C
C
ibo
C
obo
STEP 1
PREHEAT
ZONE 1
RAMP"
STEP 2
VENT
SOAK"
STEP 3
HEATING
ZONES 2 & 5
RAMP"
STEP 4
HEATING
ZONES 3 & 6
SOAK"
STEP 5
HEATING
ZONES 4 & 7
SPIKE"
170
°
C
STEP 6
VENT
STEP 7
COOLING
200
°
C
150
°
C
100
°
C
50
°
C
TIME (3 TO 7 MINUTES TOTAL)
T
MAX
SOLDER IS LIQUID FOR
40 TO 80 SECONDS
(DEPENDING ON
MASS OF ASSEMBLY)
205
°
TO
219
°
C
PEAK AT
SOLDER
JOINT
DESIRED CURVE FOR LOW
MASS ASSEMBLIES
DESIRED CURVE FOR HIGH
MASS ASSEMBLIES
100
°
C
150
°
C
160
°
C
140
°
C
Figure 6. Typical Solder Heating Profile
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