IT
參數(shù)資料
型號(hào): ATMEGA324PA-MUR
廠商: Atmel
文件頁(yè)數(shù): 9/54頁(yè)
文件大小: 0K
描述: MCU AVR 32KB FLASH 20 MHZ 44QFN
產(chǎn)品培訓(xùn)模塊: megaAVR Introduction
標(biāo)準(zhǔn)包裝: 4,000
系列: AVR® ATmega
核心處理器: AVR
芯體尺寸: 8-位
速度: 20MHz
連通性: I²C,SPI,UART/USART
外圍設(shè)備: 欠壓檢測(cè)/復(fù)位,POR,PWM,WDT
輸入/輸出數(shù): 32
程序存儲(chǔ)器容量: 32KB(16K x 16)
程序存儲(chǔ)器類型: 閃存
EEPROM 大小: 1K x 8
RAM 容量: 2K x 8
電壓 - 電源 (Vcc/Vdd): 1.8 V ~ 5.5 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 8x10b
振蕩器型: 內(nèi)部
工作溫度: -40°C ~ 85°C
封裝/外殼: 44-VFQFN 裸露焊盤
包裝: 帶卷 (TR)
其它名稱: ATMEGA324PA-MUR-ND
2001 Microchip Technology Inc.
Preliminary
DS39544A-page 143
PIC16C925/926
D025
IT1OSC
Timer1 Oscillator
PIC16LC925/926
——
50
AVDD = 3.0V
D025
Timer1 Oscillator
PIC16C925/926
50
A
VDD = 4.0V
D026
IAD
A/D Converter
PIC16LC925/926
1.0
A
A/D on, not converting
D026
A/D Converter
PIC16C925/926
1.0
A
A/D on, not converting
15.1
DC Characteristics
(Continued)
PIC16LC925/926
(Commercial, Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature
-40°C
≤ TA ≤ +85°C for industrial
0°C
≤ TA ≤ +70°C for commercial
PIC16C925/926
(Commercial, Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature
-40°C
≤ TA ≤ +85°C for industrial
0°C
≤ TA ≤ +70°C for commercial
Param
No.
Sym
Characteristic
Min
Typ Max Units
Conditions
Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only
and are not tested.
Note 1: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin load-
ing and switching rate, oscillator type, internal code execution pattern, and temperature also have an impact on
the current consumption.The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail to rail;
all I/O pins tri-stated, pulled to VDD
MCLR = VDD.
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is
measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.
4: For RC osc configuration, current through REXT is not included. The current through the resistor can be esti-
mated by the formula Ir = VDD/2REXT (mA) with REXT in kOhm.
5: The
current is the additional current consumed when this peripheral is enabled. This current should be
added to the base IDD or IPD measurement.
6: PWRT must be enabled for slow ramps.
7:
ΙLCDT1 and ΙLCDRC includes the current consumed by the LCD Module and the voltage generation
circuitry. This does not include current dissipated by the LCD panel.
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