- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄381303 > AS1152-T (AUSTRIAMICROSYSTEMS AG) Quad, LVDS, TX, 500Mbps; Package Type: TSSOP-16 PDF資料下載
參數(shù)資料
| 型號： | AS1152-T |
| 廠商： | AUSTRIAMICROSYSTEMS AG |
| 元件分類： | LVDS |
| 英文描述： | Quad, LVDS, TX, 500Mbps; Package Type: TSSOP-16 |
| 中文描述： | 四路LVDS驅(qū)動器 |
| 封裝： | TSSOP-16 |
| 文件頁數(shù)： | 13/15頁 |
| 文件大?。?/td> | 307K |
| 代理商： | AS1152-T |
www.austriamicrosystems.com
Revision 1.00
13 - 15
AS1152
Data Sheet - Package Drawings and Markings
10 Package Drawings and Markings
Figure 23. 16-pin TSSOP Package
Symbol
A
A1
A2
L
R
R1
b
b1
c
c1
θ
1
L1
aaa
bbb
ccc
ddd
e
θ
2
θ
3
Min
-
0.05
0.85
0.50
0.09
0.09
0.19
0.19
0.09
0.09
0o
Typ
-
-
0.90
0.60
-
-
-
0.22
-
-
-
1.0REF
0.10
0.10
0.05
0.20
0.65BSC
12oREF
12oREF
Variations
5.00
4.40
6.4BSC
0.65BSC
16
Max
1.10
0.15
0.95
0.75
-
-
0.30
0.25
0.20
0.16
8o
Notes
1,2
1,2
1,2
1,2
1,2
1,2
1,2,5
1,2
1,2
1,2
1,2
1,2
1,2
1,2
1,2
1,2
1,2
1,2
1,2
D
E1
E
e
N
4.90
4.30
5.10
4.50
1,2,3,8
1,2,4,8
1,2
1,2
1,2,6
Notes:
1. All dimensions are in millimeters; angles in degrees.
2. Dimensioning and tolerancing per
ASME Y14.5M – 1994
.
3. Dimension D does not include mold flash, protrusions, or gate
burrs. Mold flash, protrusions, and gate burrs shall not exceed
0.15mm per side.
4. Dimension E1 does not include interlead flash or protrusion.
Interlead flash or protrusions shall not exceed 0.25mm per
side.
5. Dimension b does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08mm total in excess of the b
dimension at maximum material condition. Dambar cannot be
located on the lower radius of the foot.
6. Terminal numbers are for reference only.
7. Datums A and B to be determined at datum plane H.
8. Dimensions D and E1 are to be determined at datum plane H.
9. This dimension applies only to variations with an even number
of leads per side.
10. Cross section A-A to be determined at 0.10 to 0.25mm from
the leadtip.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| AS1153-T | Dual 260Mbps LVDS Receiver; Package Type: SOIC-8 |
| AS1154-BSOT | Dual LVDS Driver, 800Mbps; Package Type: SOIC-8 |
| AS1301A-BTDT | 5V/50mA Inductorless Boost; Package Type: TDFN(3x3)-10 |
| AS1301A-BWLT | 5V/50mA Inductorless Boost; Package Type: CS-WLP(1.5x1.5)-8 |
| AS1302-BWLT | 5V/30mA Inductorless Boost |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AS1153 | 功能描述:LVDS 接口集成電路 RoHS:否 制造商:Texas Instruments 激勵器數(shù)量:4 接收機數(shù)量:4 數(shù)據(jù)速率:155.5 Mbps 工作電源電壓:5 V 最大功率耗散:1025 mW 最大工作溫度:+ 85 C 封裝 / 箱體:SOIC-16 Narrow 封裝:Reel |
| AS1153_V2 | 制造商:AMSCO 制造商全稱:austriamicrosystems AG 功能描述:Dual LVDS Receiver |
| AS1153-T | 功能描述:LVDS 接口集成電路 RoHS:否 制造商:Texas Instruments 激勵器數(shù)量:4 接收機數(shù)量:4 數(shù)據(jù)速率:155.5 Mbps 工作電源電壓:5 V 最大功率耗散:1025 mW 最大工作溫度:+ 85 C 封裝 / 箱體:SOIC-16 Narrow 封裝:Reel |
| AS1154 | 制造商:AMSCO 制造商全稱:austriamicrosystems AG 功能描述:Single/Dual LVDS Driver |
| AS1154_1 | 制造商:AMSCO 制造商全稱:austriamicrosystems AG 功能描述:Single/Dual LVDS Driver |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。