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參數(shù)資料
| 型號： | APXS006A0X-SRDZ |
| 廠商： | LINEAGE POWER LLC |
| 元件分類： | 電源模塊 |
| 英文描述： | 1-OUTPUT 33 W DC-DC REG PWR SUPPLY MODULE |
| 封裝： | ROHS COMPLIANT, SMT-10 |
| 文件頁數(shù)： | 17/25頁 |
| 文件大?。?/td> | 746K |
| 代理商： | APXS006A0X-SRDZ |
Data Sheet
November 22, 2010
12V Pico TLynxTM 6A: Non-isolated DC-DC Power Modules
4.5 – 14Vdc input; 0.59Vdc to 5.5Vdc output; 6A output current
LINEAGE POWER
24
Surface Mount Information
Pick and Place
The 12V Pico TLynx
TM 6A modules use an open frame
construction and are designed for a fully automated
assembly process. The modules are fitted with a label
designed to provide a large surface area for pick and
place operations. The label meets all the requirements
for surface mount processing, as well as safety
standards, and is able to withstand reflow
temperatures of up to 300
oC. The label also carries
product information such as product code, serial
number and the location of manufacture.
Nozzle Recommendations
The module weight has been kept to a minimum by
using open frame construction. Variables such as
nozzle size, tip style, vacuum pressure and placement
speed should be considered to optimize this process.
The minimum recommended inside nozzle diameter
for reliable operation is 3mm. The maximum nozzle
outer diameter, which will safely fit within the allowable
component spacing, is 7 mm.
Lead Free Soldering
The 12V Pico TLynx
TM 6A modules are lead-free (Pb-
free) and RoHS compliant and fully compatible in a Pb-
free soldering process. Failure to observe the
instructions below may result in the failure of or cause
damage to the modules and can adversely affect long-
term reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for
both Pb-free solder profiles and MSL classification
procedures. This standard provides a recommended
forced-air-convection reflow profile based on the
volume and thickness of the package (table 4-2). The
suggested Pb-free solder paste is Sn/Ag/Cu (SAC).
The recommended linear reflow profile using Sn/Ag/Cu
solder is shown in Fig. 51. Soldering outside of the
recommended profile requires testing to verify results
and performance.
MSL Rating
The 12V Pico TLynx
TM 6A modules have a MSL rating
of 2.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devices). Moisture barrier
bags (MBB) with desiccant are required for MSL
ratings of 2 or greater. These sealed packages should
not be broken until time of use. Once the original
package is broken, the floor life of the product at
conditions of
≤ 30°C and 60% relative humidity varies
according to the MSL rating (see J-STD-033A). The
shelf life for dry packed SMT packages will be a
minimum of 12 months from the bag seal date, when
stored at the following conditions: < 40° C, < 90%
relative humidity.
Per J-STD-020 Rev. C
0
50
100
150
200
250
300
Reflow Time (Seconds)
R
efl
ow
T
em
p
(°
C
)
Heating Zone
1°C/Second
Peak Temp 260°C
* Min. Time Above 235°C
15 Seconds
*Time Above 217°C
60 Seconds
Cooling
Zone
Figure 51. Recommended linear reflow profile
using Sn/Ag/Cu solder.
Post Solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the testability
of the finished circuit-board assembly. For guidance on
appropriate soldering, cleaning and drying procedures,
refer to Board Mounted Power Modules: Soldering and
Cleaning Application Note (AN04-001).
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| APXS006A0X-SRZ | 功能描述:DC/DC轉(zhuǎn)換器 SMT in 4.5-14Vdc out 0.59-5.5Vdc 6A RoHS:否 制造商:Murata 產(chǎn)品: 輸出功率: 輸入電壓范圍:3.6 V to 5.5 V 輸入電壓（標(biāo)稱）: 輸出端數(shù)量:1 輸出電壓（通道 1）:3.3 V 輸出電流（通道 1）:600 mA 輸出電壓（通道 2）: 輸出電流（通道 2）: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體尺寸: |
| APXS100ARA121MF61G | 功能描述:鋁有機(jī)聚合物電容器 10Volts 120uF 6X6 RoHS:否 制造商:Panasonic Electronic Components 電容:470 uF 容差:20 % 電壓額定值:2.5 V ESR:4.5 mOhms 工作溫度范圍:- 40 C to + 105 C 端接類型:SMD/SMT 外殼直徑: 外殼長度:7.3 mm 外殼寬度:4.3 mm 外殼高度:1.9 mm 封裝:Reel |
| APXS100ARA151MH70G | 功能描述:鋁有機(jī)聚合物電容器 10Volts 150uF 8X7 RoHS:否 制造商:Panasonic Electronic Components 電容:470 uF 容差:20 % 電壓額定值:2.5 V ESR:4.5 mOhms 工作溫度范圍:- 40 C to + 105 C 端接類型:SMD/SMT 外殼直徑: 外殼長度:7.3 mm 外殼寬度:4.3 mm 外殼高度:1.9 mm 封裝:Reel |
| APXS100ARA330ME61G | 功能描述:鋁有機(jī)聚合物電容器 10Volts 33uF 5X6 RoHS:否 制造商:Panasonic Electronic Components 電容:470 uF 容差:20 % 電壓額定值:2.5 V ESR:4.5 mOhms 工作溫度范圍:- 40 C to + 105 C 端接類型:SMD/SMT 外殼直徑: 外殼長度:7.3 mm 外殼寬度:4.3 mm 外殼高度:1.9 mm 封裝:Reel |
| APXS100ARA680ME61G | 功能描述:鋁有機(jī)聚合物電容器 10Volts 68uF 5X6 RoHS:否 制造商:Panasonic Electronic Components 電容:470 uF 容差:20 % 電壓額定值:2.5 V ESR:4.5 mOhms 工作溫度范圍:- 40 C to + 105 C 端接類型:SMD/SMT 外殼直徑: 外殼長度:7.3 mm 外殼寬度:4.3 mm 外殼高度:1.9 mm 封裝:Reel |
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