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參數(shù)資料
| 型號(hào)： | APTM50H10FT3G |
| 廠商： | MICROSEMI POWER PRODUCTS GROUP |
| 元件分類： | JFETs |
| 英文描述： | Full - Bridge MOSFET Power Module |
| 中文描述： | 37 A, 500 V, 0.12 ohm, 4 CHANNEL, N-CHANNEL, Si, POWER, MOSFET |
| 封裝： | ROHS COMPLIANT, SP3, 25 PIN |
| 文件頁(yè)數(shù)： | 3/6頁(yè) |
| 文件大?。?/td> | 309K |
| 代理商： | APTM50H10FT3G |
APTM50H10FT3G
A
www.microsemi.com
3 - 6
Thermal and package characteristics
Symbol Characteristic
R
thJC
Junction to Case Thermal Resistance
V
ISOL
RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz
T
J
Operating junction temperature range
T
STG
Storage Temperature Range
T
C
Operating Case Temperature
Torque Mounting torque
Wt
Package Weight
Temperature sensor NTC
(see application note APT0406 on www.microsemi.com for more information).
Symbol Characteristic
R
25
Resistance @ 25°C
B
25/85
T
25
= 298.15 K
=
B
exp
85
/
25
Min
2500
-40
-40
-40
2.5
Typ
Max
0.40
150
125
100
4.7
110
Unit
°C/W
V
°C
To heatsink
M4
N.m
g
Min
Typ
50
3952
Max
Unit
k
K
T
T
R
R
T
1
1
25
25
SP3 Package outline
(dimensions in mm)
1
12
2
1
See application note 1901 - Mounting Instructions for SP3 Power Modules on www.microsemi.com
T: Thermistor temperature
R
T
: Thermistor value at T
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