參數(shù)資料
型號(hào): APTGF50X60T3G
廠商: MICROSEMI POWER PRODUCTS GROUP
元件分類(lèi): IGBT 晶體管
英文描述: 65 A, 600 V, N-CHANNEL IGBT
封裝: ROHS COMPLIANT, SP3, 25 PIN
文件頁(yè)數(shù): 1/6頁(yè)
文件大小: 313K
代理商: APTGF50X60T3G
APTGF50X60T3G
A
P
TG
F50X60T3G
R
ev
0
Ju
ly,
2007
www.microsemi.com
1- 6
Absolute maximum ratings
Symbol
Parameter
Max ratings
Unit
VCES
Collector - Emitter Breakdown Voltage
600
V
TC = 25°C
65
IC
Continuous Collector Current
TC = 80°C
50 *
ICM
Pulsed Collector Current
TC = 25°C
230
A
VGE
Gate – Emitter Voltage
±20
V
PD
Maximum Power Dissipation
TC = 25°C
250
W
RBSOA Reverse Bias Safe Operating Area
Tj = 125°C
100A @ 500V
* Specification of IGBT device but output current must be limited to 40A at Tc=80°C not to exceed a connectors
temperature greater than 120°C.
These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. See application note
APT0502 on www.microsemi.com
31
14
R1
13
2
28
25
23
15
20
16
19
10
18
22
30
29
3
4
8
7
11
12
It is recommended to connect a decoupling capacitor
between pins 31 & 2 to reduce switching overvoltages, if DC
Power is connected between pins 15, 16 & 12.
Pins 15 & 16 must be shorted together.
16
15
18
20
23 22
13
11 12
14
8
7
29
30
28 27 26
3
32
31
10
19
2
25
4
VCES = 600V
IC = 50A* @ Tc = 80°C
Application
Motor control
Features
Non Punch Through (NPT) Fast IGBT
-
Low voltage drop
-
Low tail current
-
Switching frequency up to 100 kHz
-
Soft recovery parallel diodes
-
Low diode VF
-
Low leakage current
-
RBSOA and SCSOA rated
Kelvin emitter for easy drive
Very low stray inductance
High level of integration
Internal thermistor for temperature monitoring
Benefits
Outstanding performance at high frequency
operation
Direct mounting to heatsink (isolated package)
Low junction to case thermal resistance
Solderable terminals both for power and signal
for easy PCB mounting
Low profile
RoHS compliant
3 Phase bridge
NPT IGBT Power Module
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