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參數(shù)資料
| 型號： | APM9435KC-TR |
| 廠商： | Anpec Electronics Corporation |
| 英文描述： | P-Channel Enhancement Mode MOSFET |
| 中文描述： | P溝道增強型MOS管 |
| 文件頁數(shù)： | 7/9頁 |
| 文件大?。?/td> | 123K |
| 代理商： | APM9435KC-TR |
Copyright
ANPEC Electronics Corp.
Rev. A.4 - Mar., 2003
APM9435
www.anpec.com.tw
7
Reflow Condition
(IR/Convection or VPR Reflow)
Physical S pecifications
Pre-heat temperature
183 C
Peak temperature
Time
t
Classification R eflow Profiles
Convection or IR/
Convection
3
°
C/second max.
120 seconds max
60 – 150 seconds
VPR
Average ramp-up rate(183
°
C to Peak)
Preheat temperature 125 ± 25
°
C)
Temperature maintained above 183
°
C
Time within 5
°
C of actual peak temperature 10 –20 seconds
Peak temperature range
Ramp-down rate
Time 25
°
C to peak temperature
10
°
C /second max.
60 seconds
215-219
°
C or 235 +5/-0
°
C
10
°
C /second max.
220 +5/-0
°
C or 235 +5/-0
°
C
6
°
C /second max.
6 minutes max.
Package R eflow Conditions
pkg. thickness
≥
2.5mm
and all bgas
Convection
220 +5/-0
°
C
VPR 215-219
°
C
IR/Convection 220 +5/-0
°
C
pkg. thickness < 2.5mm and
pkg. volume
≥
350 mm3
pkg. thickness < 2.5mm and pkg.
volume < 350mm3
Convection 235 +5/-0
°
C
VPR 235 +5/-0
°
C
IR/Convection 235 +5/-0
°
C
Terminal Material
Lead Solderability
Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb)
Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.
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