
^lwNMNP
February 2006
www.aosmd.com
Page 12 of 16
The strategy for choosing R
and C
is to set the
cross over frequency with R
and set the
compensator zero with C
. Using selected crossover
frequency, f
C
, to calculate R
C
:
V
f
R
×
=
CS
EA
O
FB
O
C
C
G
G
C
V
×
×
×
π
2
where f
is desired crossover frequency;
V
FB
is 0.8V;
G
is the error amplifier transconductance,
which is 20010
G
is the current sense circuit
transconductance, which is 6.68 A/V;
The compensation capacitor C
and resistor R
C
together make a zero. This zero is put somewhere
close to the dominate pole f
but lower than 1/5 of
selected crossover frequency. C
C
can is selected by:
-6
A/V;
1
2
5
R
×
π
p
C
C
f
C
×
=
Equation above can also be simplified to:
C
L
O
C
R
R
C
C
×
=
An easy-to-use application software which helps to
design and simulate the compensation loop can be
found at www.aosmd.com.
Thermal management and layout consideration
In the AOZ1013 buck regulator circuit, high pulsing
current flows through two circuit loops. The first loop
starts from the input capacitors, to the VIN pin, to the
LX pins, to the filter inductor, to the output capacitor
and load, and then return to the input capacitor
through ground. Current flows in the first loop when
the high side switch is on. The second loop starts
from inductor, to the output capacitors and load, to
the anode of Schottky diode, to the cathode of
Schottky diode. Current flows in the second loop
when the low side diode is on.
In PCB layout, minimizing the two loops area reduces
the noise of this circuit and improves efficiency. A
ground plane is strongly recommended to connect
input capacitor, output capacitor, and PGND pin of
the AOZ1013.
In the AOZ1013 buck regulator circuit, the major
power dissipating components are the AOZ1013, the
Schottky diode and output inductor. The total power
dissipation of converter circuit can be measured by
input power minus output power.
V
P
=
_
The
power
dissipation
approximated as:
I
P
_
1
=
Where V
FW_Schottky
is the Schottky diode forward
voltage drop.
The
power
dissipation
approximately calculated by output current and DCR
of inductor.
=
O
loss
indcutor
I
P
The actual junction temperature can be calculated with
power dissipation in the AOZ1013 and thermal
impedance from junction to ambient.
P
P
T
=
(
_
The maximum junction temperature of AOZ1013 is
150oC, which limits the maximum load current
capability. Please see the thermal de-rating curves for
maximum load current of the AOZ1013 under different
ambient temperature.
The thermal performance of the AOZ1013 is strongly
affected by the PCB layout. Extra care should be
taken by users during design process to ensure that
the IC will operate under the recommended
environmental conditions.
Several layout tips are listed below for the best electric
and thermal performance. Figure 3 below illustrate a
PCB layout example as reference.
1. Do not use thermal relief connection to the
VIN and the PGND pin. Pour a maximized
copper area to the PGND pin and the VIN pin
to help thermal dissipation.
2. Input capacitor should be connected to the
VIN pin and the PGND pin as close as
possible.
3. A ground plane is preferred. If a ground plane
is not used, separate PGND from AGND and
connect them only at one point to avoid the
PGND pin noise coupling to the AGND pin.
4. Make the current trace from LX pins to L to Co
to the PGND as short as possible.
O
O
IN
IN
loss
total
I
V
I
in
Schottky
can
be
Schottky
FW
O
loss
diode
V
D
_
)
of
inductor
can
be
1
2
_
inductor
R
JA
loss
inductor
P
loss
diode
loss
total
junction
Θ
)
_
_