參數(shù)資料
型號： AOP605_06
廠商： ALPHA
英文描述： Plastic Encapsulated Device
中文描述： 塑料封裝器件
文件頁數(shù)： 3/5頁
文件大?。?/td> 113K
代理商： AOP605_06
3
II. Die / Package Information:
Process
AOP605
Standard sub-micron
low voltage complementary process
8 lead PDIP 8 lead PDIP
Copper with Solder Plate
Silver epoxy
2 mils Au wire
Epoxy resin with silica filler
90/10
UL-94 V-0
Ti / Ni / Ag
Up to Level 1 *
AOP605L (Green Compound)
Standard sub-micron
Package Type
Lead Frame
Die Attach
Bond wire
Mold Material
Filler % (Spherical/Flake)
Flammability Rating
Backside Metallization
Moisture Level
Note *
based on info provided by assembler and mold compound supplier
III. Result of Reliability Stress for AOP605 (Standard) &
AOP605L (Green)
Test Item
Test Condition
Time Point
Copper with Solder Plate
Silver epoxy
2 mils Au wire
Epoxy resin with silica filler
100/0
UL-94 V-0
Ti / Ni / Ag
Up to Level 1*
Lot Attribution
Total
Sample size
Number of
Failures
Solder
Reflow
Precondition
Standard: 1hr PCT+3
cycle reflow@250
°
c
Green: 168hr 85
°
c
/85%RH +3 cycle
reflow@250
°
c
Temp = 150
°
c,
Vgs=100% of Vgsmax
0hr
Standard: 11 lots
Green: 4 lots
2365 pcs
0
HTGB
168 / 500
hrs
1000 hrs
168 / 500
hrs
1000 hrs
6 lots
(Note A*)
492 pcs
77+5 pcs / lot
0
HTRB
HAST
Temp = 150
°
c,
Vds=80% of Vdsmax
6 lots
(Note A*)
492 pcs
77+5 pcs / lot
0
130 +/- 2
°
c, 85%RH, 33.3
psi, Vgs = 80% of Vgs
max
100 hrs
Standard: 11 lots
Green: 4 lots
(Note B**)
Standard: 11 lots
Green: 3 lots
(Note B**)
Standard: 11 lots
Green: 3 lots
(Note B**)
825 pcs
50+5 pcs / lot
0
Pressure Pot
121
°
c, 15+/-1 PSIG,
RH=100%
96 hrs
770 pcs
50+5 pcs / lot
0
Temperature
Cycle
-65
°
c to 150
°
c,
air to air
250 / 500
cycles
770 pcs
50+5 pcs / lot
0
DPA
Internal Vision
Cross-section
X-ray
NA
5
5
5
5
5
5
5
5
0
CSAM
NA
0
相關(guān)PDF資料
PDF描述
AOP605L Plastic Encapsulated Device
AOP606 Complementary Enhancement Mode Field Effect Transistor
AOP606L Complementary Enhancement Mode Field Effect Transistor
AOP607 Complementary Enhancement Mode Field Effect Transistor
AOP607L Complementary Enhancement Mode Field Effect Transistor
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
AOP605L 制造商:AOSMD 制造商全稱:Alpha & Omega Semiconductors 功能描述:Plastic Encapsulated Device
AOP606 制造商:AOSMD 制造商全稱:Alpha & Omega Semiconductors 功能描述:Complementary Enhancement Mode Field Effect Transistor
AOP606L 制造商:AOSMD 制造商全稱:Alpha & Omega Semiconductors 功能描述:Complementary Enhancement Mode Field Effect Transistor
AOP607 功能描述:MOSFET N/P-CH COMPL 60V 8-PDIP RoHS:是 類別:分離式半導體產(chǎn)品 >> FET - 陣列 系列:- 產(chǎn)品目錄繪圖:8-SOIC Mosfet Package 標準包裝:1 系列:- FET 型:2 個 N 溝道（雙） FET 特點:邏輯電平門 漏極至源極電壓(Vdss):60V 電流 - 連續(xù)漏極(Id) @ 25° C:3A 開態(tài)Rds（最大）@ Id, Vgs @ 25° C:75 毫歐 @ 4.6A，10V Id 時的 Vgs(th)（最大）:3V @ 250µA 閘電荷(Qg) @ Vgs:20nC @ 10V 輸入電容 (Ciss) @ Vds:- 功率 - 最大:1.4W 安裝類型:表面貼裝 封裝/外殼:PowerPAK? SO-8 供應(yīng)商設(shè)備封裝:PowerPAK? SO-8 包裝:Digi-Reel® 產(chǎn)品目錄頁面:1664 (CN2011-ZH PDF) 其它名稱:SI7948DP-T1-GE3DKR
AOP607L 制造商:AOSMD 制造商全稱:Alpha & Omega Semiconductors 功能描述:Complementary Enhancement Mode Field Effect Transistor
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