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參數(shù)資料
| 型號(hào)： | AOL1440 |
| 廠商： | ALPHA |
| 英文描述： | N-Channel Enhancement Mode Field Effect Transistor |
| 中文描述： | N溝道增強(qiáng)型場(chǎng)效應(yīng)管 |
| 文件頁(yè)數(shù)： | 2/5頁(yè) |
| 文件大?。?/td> | 133K |
| 代理商： | AOL1440 |
AOL1440
Symbol
STATIC PARAMETERS
Drain-Source Breakdown Voltage
Min
Typ
Max
Units
BV
DSS
25
V
0.005
1
5
T
J
=55°C
I
GSS
V
GS(th)
I
D(ON)
100
4
nA
V
A
2
3
200
2.7
3.5
4
5.6
75
0.7
3.2
4
5.2
m
m
S
V
A
T
J
=125°C
g
FS
V
SD
I
S
DYNAMIC PARAMETERS
1
55
C
iss
C
oss
C
rss
R
g
SWITCHING PARAMETERS
Total Gate Charge
2100
850
400
0.35
2400
pF
pF
pF
1
Q
g
(12V)
Q
g
(10V)
Q
gs
Q
gd
t
D(on)
t
r
t
D(off)
t
f
t
rr
Q
rr
40
33
11
14
12
19
15
8.5
42
34
50
nC
nC
nC
nC
ns
ns
ns
ns
ns
nC
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
Gate Drain Charge
Turn-On DelayTime
V
GS
=0V, V
DS
=12.5V, f=1MHz
Total Gate Charge
Gate Source Charge
Gate resistance
V
GS
=0V, V
DS
=0V, f=1MHz
V
GS
=10V, V
DS
=12.5V, I
D
=20A
Turn-On Rise Time
Turn-Off DelayTime
Turn-Off Fall Time
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
A: The value of R
θ
JA
is measured with the device in a still air environment with T
A
=25°C.
B. The power dissipation P
D
is based on T
J(MAX)
=175°C, using junction-to-case thermal resistance, and is more useful in setting the upper
dissipation limit for cases where additional heatsinking is used.
C: Repetitive rating, pulse width limited by junction temperature T
J(MAX)
=175°C.
D. The R
θ
JA
is the sum of the thermal impedence from junction to case R
θ
JC
and case to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300
μ
s pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-case thermal impedence which is measured with the device mounted to a large heatsink, assuming a
maximum junction temperature of T
J(MAX)
=175°C.
G. The maximum current rating is limited by bond-wires.
H. These tests are performed with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with T
A
=25°C. The SOA
curve provides a single pulse rating.
V
GS
=10V, V
DS
=12.5V, R
L
=0.68
,
R
GEN
=3
m
I
S
=1A,V
GS
=0V
V
DS
=5V, I
D
=20A
V
GS
=10V, I
D
=20A
V
GS
=12V, I
D
=20A
Maximum Body-Diode Continuous Current
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Forward Transconductance
Diode Forward Voltage
R
DS(ON)
Static Drain-Source On-Resistance
I
DSS
μ
A
Gate Threshold Voltage
On state drain current
V
DS
=V
GS
I
D
=250
μ
A
V
GS
=12V, V
DS
=5V
V
GS
=20V, I
D
=20A
V
DS
=20V, V
GS
=0V
V
DS
=0V, V
GS
= ±30V
Zero Gate Voltage Drain Current
Gate-Body leakage current
Electrical Characteristics (T
J
=25°C unless otherwise noted)
Parameter
Conditions
I
F
=20A, dI/dt=100A/
μ
s
I
D
=250
μ
A, V
GS
=0V
I
F
=20A, dI/dt=100A/
μ
s
Rev0. July 2006
Alpha & Omega Semiconductor, Ltd.
www.aosmd.com
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