- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄364674 > AMIS42700FHA Dual High-Speed CAN Transceiver PDF資料下載
參數(shù)資料
| 型號： | AMIS42700FHA |
| 元件分類： | CAN |
| 英文描述： | Dual High-Speed CAN Transceiver |
| 中文描述： | 雙高速CAN收發(fā)器 |
| 文件頁數(shù)： | 15/16頁 |
| 文件大?。?/td> | 308K |
| 代理商： | AMIS42700FHA |
AMIS-42700 Dual High-Speed CAN Transceiver
10.0 Soldering
Preimnary Data Shee
10
.1 Introduction to Soldering Surface Mount Packages
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in the AMIS
“Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). There is no soldering method that
is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards
with high population densities. In these situations reflow soldering is often used.
10.
2 Re-flow Soldering
Re-flow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-
circuit board by screen-printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for
re-flowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)
vary between 100 and 200 seconds depending on heating method. Typical re-flow peak temperatures range from 215 to 250°C.
The top-surface temperature of the packages should preferably be kept below 230°C.
10.
3 Wave Soldering
Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high
component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-
wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal
results:
Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth
laminar wave.
For packages with leads on two sides and a pitch (e):
o
Larger than or equal to 1.27mm, the footprint longitudinal axis is preferred to be parallel to the transport direction
of the printed-circuit board;
o
Smaller than 1.27mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-
circuit board. The footprint must incorporate solder thieves at the downstream end.
For packages with leads on four sides, the footprint must be placed at a 45o angle to the transport direction of the printed-
circuit board. The footprint must incorporate solder thieves downstream and at the side corners.
During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by
screen-printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is
four seconds at 250°C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
10.
4 Manual Soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24V or less) soldering iron applied to
the flat part of the lead. Contact time must be limited to 10 seconds at up to 300°C.
When using a dedicated tool, all other leads can be soldered in one operation within two to five seconds between 270 and 320°C.
Table 11: Soldering Process
Soldering Method
Package
Wave
Re-flow(1)
BGA, SQFP
Not suitable
Suitable
HLQFP, HSQFP, HSOP, HTSSOP, SMS
Not suitable (2)
Suitable
PLCC (3) , SO, SOJ
Suitable
Suitable
LQFP, QFP, TQFP
Not recommended (3)(4) Suitable
SSOP, TSSOP, VSO
Not recommended (5)
Suitable
Notes:
1.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size
of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For
details, refer to the drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods.”
2.
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and
as solder may stick to the heatsink (on top version).
3.
If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder
thieves downstream and at the side corners.
4.
Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8mm; it is definitely not suitable for packages with a
pitch (e) equal to or smaller than 0.65mm.
5.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65mm; it is definitely not suitable for packages with a
pitch (e) equal to or smaller than 0.5mm.
AMI Semiconductor
– Rev. 1.4, May 05 - Preliminary
www.amis.com
15
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| AMIS-49200 | Fieldbus MAU Chip |
| AMIS-50050 | Spread Spectrum Baseband Controller |
| AMIS-50051 | Digital Demodulator |
| AMIS-52000 | Single-Chip Radio Transceiver |
| AMIS-52100 | Transceiver with Clock and Data Recovery |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AMIS42700WCGA4H | 功能描述:CAN 接口集成電路 DUAL CAN HS TRANSC. RoHS:否 制造商:Texas Instruments 類型:Transceivers 工作電源電壓:5 V 電源電流: 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:SOIC-8 封裝:Tube |
| AMIS42700WCGA4RH | 功能描述:CAN 接口集成電路 DUAL CAN HS TRANSC. RoHS:否 制造商:Texas Instruments 類型:Transceivers 工作電源電壓:5 V 電源電流: 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:SOIC-8 封裝:Tube |
| AMIS-42770 | 制造商:ONSEMI 制造商全稱:ON Semiconductor 功能描述:Dual High Speed CAN Transceiver |
| AMIS42770ICAW1G | 功能描述:CAN 接口集成電路 HS CAN REPEATER RoHS:否 制造商:Texas Instruments 類型:Transceivers 工作電源電壓:5 V 電源電流: 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:SOIC-8 封裝:Tube |
| AMIS42770ICAW1RG | 功能描述:CAN 接口集成電路 HS CAN REPEATER RoHS:否 制造商:Texas Instruments 類型:Transceivers 工作電源電壓:5 V 電源電流: 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:SOIC-8 封裝:Tube |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。