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參數(shù)資料
| 型號： | AMIS-720442-A |
| 英文描述： | 400dpi Contact Image Sensor |
| 中文描述： | 400dpi的接觸式圖像傳感器 |
| 文件頁數(shù)： | 6/16頁 |
| 文件大?。?/td> | 391K |
| 代理商： | AMIS-720442-A |
AMIS-720442-A: 400dpi Contact Image Sensor
Data Sheet
6.0 Two Test Setups for Specifications and Performance
6.1 First Setup
The standard specifications are the image sensor tests that are performed on the wafer probe machine where each device on the wafer
is tested in production. However, the data in these measurements are measured with a clock frequency at a fixed 500kHz. Since the
al to the clock rate, the pixel rate is also at 500kHz. The specification under Section 7.0 is the wafer probe
specifications, Table 2.
with these devices operate in excess of 5.0MHz. Accordingly the wafer probe specifications are supplemented
with high frequency clocking performance using an A6 length modules PCB board.
pixel rate is equ
6.2 Second Setup
The CIS modules made
7.0 Electro-Optical Characteristics (25
°
C)
The electro-optical characteristics of the AMIS-720442-A imagin
used to test each die at 25
Table 2: Electro-Optical Characteristics
Parameters
Number of photo-elements
Pixel-to-pixel spacing
Line scanning rate
Clock frequency
Output voltage
Output voltage non-uniformity
Dark output voltage
Dark output non-uniformity
Adjacent pixel non-uniformity
Chip-to-chip non-uniformity
Notes:
(1)
Tint stands for the l
scan process, as soo
as, CP, m
ivided by
is especially
ck, CP, frequency and it is, al
Fclk is the device’s clo
(2)
mass-producing high frequency CIS modules, using only the wafer test to qualify them. Hence, the device, which is tested on an A6 size module’s PCB board at
the standard high speed, meets specifications.
Vpavg =
∑
Vp(n)/Npixels (average level in one line scan).
Where
Vp(n) is the amplitude of n
pixel in the sensor chip and Npixels is the total number of pixels in sensor chip. Vpavg is converted from impulse current
video pixel into a voltage output. See Figure 4, in Section 4.0 and Figure 5, in Section 5.0.
Vpavg is calibrated for each image sensor type because of probe card variations, as well as, the interfacing circuits to the wafer probe machine.
Up is the uniformity specification, measured under a uniform exposing light exposure. Up = [Vp(max) - Vpavg] / Vpavg x 100% or [Vpavg - Vp(min)] / Vpavg} x
100%, whichever is greater.
Where
Vp(max) is the maximum pixel output voltage in the light.
Vp(min) is the minimum pixel output voltage in the dark.
The pixel Vp(n) is one n
th
pixel in Npixels in the sensor.
(5)
Vd =
∑
Vp(n)/Npixels. Where Vp(n) is the pixels signal amplitude of the n pixel of the sensor. Dark is where light is off, leaving the image surface unexposed.
(6)
Ud = Vdmax – Vdmin.
Upadj = MAX[ | (Vp(n) - Vp(n+l) | / Vp(n)) x 100%. Upadj is the non-un
Ucc is the uniformity specifications, measured among the good die
following algorithm: Vpavg of all the good dies on the wafer are a
and the one with minimum Vpavg is assigned Vpavg(min). Then UCC = {[Vpavg(max)-Vpavg(min)]/VGpavg}x100.
g sensor chip are listed in Table 2. This is the wafer probe specification
°
C.
Symbols
Tint
(1)
Fclk
(2)
Vpavg
(3)
Up
(4
Vd
(5)
Ud
(6)
Upadj
(7)
Ucc
(8)
Typical
128
~62.5
128/Fclk
500
1.8 ± 0.35
±
7.5
<100
<100
<7.5
±
7.5
Units
Elements
μ
m
μ
s/line
kHz
V
%
mV
mV
%
%
Notes
See Note 2 for higher clock speed (maximum 5MHz)
)
ine scanning
n
tegration time. It is dete
k, acquire
frequency
the wafer pr
set for
by the time interval between two start pulses, where the start pulses start the line-
rnal shift register. To calculate the minimum integration time in a scan it is number
odule it is the number of sensors times the number of pixels in the sensor, all over the clock
order to cal
te the Vpavg, see Note (3).
the pix
the wafer test Fclk is set to 500
so, equal to
el rate. In
shifts it into
. However, AMIS has been successfully
kHz
(3)
(4)
(7)
(8)
iformity in percentage. It is the amplitude difference between two neighboring pixels.
on the wafer. Under uniform light exposure the sensors are measured and calculated with
veraged and assigned VGpavg. Then the die with maximum Vpavg is assigned Vpavg(max),
rate or the in
dule clo
o
the clock
rmined
the inte
of pixels in the scan d
frequency. This time
c
s it and
. In a CIS m
obes in
ibra
6
AMI Semiconductor
– May 06, M-20571-001
www.amis.com
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| AMIS-720639 | 600dpi CIS Sensor Chip |
| AMIS-720649 | Contact Image Sensor |
| AMIS-720658 | Contact Image Sensor |
| AMIS-721250 | Contact Image Sensor |
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| AMIS-720639 | 制造商:AMI 制造商全稱:AMI 功能描述:600dpi CIS Sensor Chip |
| AMIS-720649 | 制造商:AMI 制造商全稱:AMI 功能描述:Contact Image Sensor |
| AMIS-720658 | 制造商:AMI 制造商全稱:AMI 功能描述:Contact Image Sensor |
| AMIS-721250 | 制造商:AMI 制造商全稱:AMI 功能描述:Contact Image Sensor |
| AMIS-722402 | 制造商:AMI 制造商全稱:AMI 功能描述:Contact Image Sensor |
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