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參數(shù)資料
| 型號： | AMIS-39100 |
| 英文描述： | Octal High Side Driver with Protection |
| 中文描述： | 八路高端驅(qū)動(dòng)器，帶有保護(hù) |
| 文件頁數(shù)： | 15/16頁 |
| 文件大?。?/td> | 376K |
| 代理商： | AMIS-39100 |
AMIS-39100:
Octal High Side Driver with Protection
Data Sheet
10.4 Manual Soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24V or less) soldering iron applied to the flat
part of the lead. Contact time must be limited to 10 seconds at up to 300°C.
When using a dedicated tool, all other leads can be soldered in one operation within two to five seconds between 270 and 320°C.
Table 13: Soldering Process
Package
BGA, SQFP
HLQFP, HSQFP, HSOP, HTSSOP, SMS
PLCC
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
Notes:
1.
All SMD packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package,
there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
dry pack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2.
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and
as solder may stick to the heatsink (on top version).
3.
If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder
thieves downstream and at the side corners.
4.
Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8mm; it is definitely not suitable for packages with a
pitch (e) equal or smaller than 0.65mm.
5.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65mm; it is definitely not suitable for packages with a
pitch (e) equal to or smaller than 0.5mm.
Soldering Method
Wave
Re-flow
(1)
Not suitable
Not suitable
(2)
Suitable
Not recommended
(3)(4)
Not recommended
(5)
Suitable
Suitable
Suitable
Suitable
Suitable
11.0 Revision History
Table 14: Revision History
Revision
Date
0.1
Various
0.2
June 2006
0.3
January 2007
Description
Initial document
Document formatted into new AMIS template
Update of some values in Tables 1, 2, 3, 6 and 7. Update of explanation in paragraph
8.6: Diagnostics, and paragraph 8.7: SPI Interface.
Update of Figure 8
Added section 10.0: Soldering
15
AMI Semiconductor
– Jan. 07, M-20557-002
www.amis.com
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相關(guān)代理商/技術(shù)參數(shù) |
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| AMIS39100AGA | 制造商:AMI 制造商全稱:AMI 功能描述:Octal High Side Driver with Protection |
| AMIS39100PNPB3G | 功能描述:功率驅(qū)動(dòng)器IC OCTAL HS DRVR 12V RoHS:否 制造商:Micrel 產(chǎn)品:MOSFET Gate Drivers 類型:Low Cost High or Low Side MOSFET Driver 上升時(shí)間: 下降時(shí)間: 電源電壓-最大:30 V 電源電壓-最小:2.75 V 電源電流: 最大功率耗散: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube |
| AMIS39100PNPB3RG | 功能描述:功率驅(qū)動(dòng)器IC OCTAL HS DRVR 12V RoHS:否 制造商:Micrel 產(chǎn)品:MOSFET Gate Drivers 類型:Low Cost High or Low Side MOSFET Driver 上升時(shí)間: 下降時(shí)間: 電源電壓-最大:30 V 電源電壓-最小:2.75 V 電源電流: 最大功率耗散: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube |
| AMIS-39101 | 制造商:ONSEMI 制造商全稱:ON Semiconductor 功能描述:Octal High Side Driver with Protection |
| AMIS39101AGA | 制造商:AMI 制造商全稱:AMI 功能描述:Octal High-Side Driver with Protection |
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