參數(shù)資料
型號(hào)： AM50DL128BH85IS
廠商： Advanced Micro Devices, Inc.
元件分類(lèi)： SRAM
英文描述： Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
中文描述： 堆疊式多芯片封裝（MCP）閃存和SRAM
文件頁(yè)數(shù)： 66/68頁(yè)
文件大?。?/td> 959K
代理商： AM50DL128BH85IS
64
Am50DL128BH
October 7, 2003
A D V A N C E I N F O R M A T I O N
PHYSICAL DIMENSIONS
FTA073—73-Ball Fine-Pitch Grid Array 8 x 11.6 mm
3159\38.14b
N/A
11.60 mm x 8.00 mm
PACKAGE
NOM.
---
---
---
11.60 BSC.
FTA 073
1.40
---
1.11
MAX.
8.00 BSC.
8.80 BSC.
7.20 BSC.
12
---
0.25
MIN.
1.00
10
73
0.35
0.40
0.40 BSC
A2,A3,A4,A5,A6,A7,A8,A9
D1,D10,E1,E10,F5,F6,G5,G6
H1,HL2,L3,L4,L7,L8,L9
M2,M3,M4,M5,M6,M7,M8,M9
0.30
0.80 BSC
ME
n
D
E
JEDEC
PACKAGE
SYMBOL
A
A1
A2
MD
D1
E1
NOTE
DEPOPULATED SOLDER BALL
MATRIX SIZE E DIRECTION
BALL COUNT
MATRIX FOOTPRINT
MATRIX FOOTPRINT
BALL PITCH
0.80 BSC
BALL PITCH
SOLDER BALL PLACEMENT
BODY SIZE
BALL HEIGHT
BODY THICKNESS
BODY SIZE
PROFILE
BALL DIAMETER
MATRIX SIZE D DIRECTION
eE
eD
SD/SE
NOTES:
1.
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3.
BALL POSITION DESIGNATION PER JESD 95-1, SPP-010.
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
5.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
6
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
8.
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
9.
N/A
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTION OR OTHER MEANS.
b
O
10
INDEX MARK
73X
C
0.15
(2X)
(2X)
C
0.15
B
A
6
b
M
M
0.20
C
C
0.15
0.08
C
C A B
D
E
PIN A1
CORNER
C
TOP VIEW
SIDE VIEW
A2
A1
A
0.08
BOTTOM VIEW
L
M
eD
CORNER
E1
7
SE
D1
A
B
D
C
E
F
H
G
10
8
9
7
5
6
4
2
3
J
K
1
eE
SD
PIN A1
7
相關(guān)PDF資料
PDF描述
AM50DL128CG70IS 64 Megabit (4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memories and 64 Mbit (4 M x 16-Bit) Pseudo Static RAM
AM50DL128CG70IT 64 Megabit (4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memories and 64 Mbit (4 M x 16-Bit) Pseudo Static RAM
AM50DL128CG85IS 64 Megabit (4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memories and 64 Mbit (4 M x 16-Bit) Pseudo Static RAM
AM50DL128CG85IT 64 Megabit (4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memories and 64 Mbit (4 M x 16-Bit) Pseudo Static RAM
AM50DLI28BG Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
AM50DL128BH85IT 制造商:SPANSION 制造商全稱(chēng):SPANSION 功能描述:Two Am29DL640G 64 Megabit (8 M x 8-Bit/4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memories
AM50DL128CG 制造商:SPANSION 制造商全稱(chēng):SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM50DL128CG70IS 制造商:SPANSION 制造商全稱(chēng):SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM50DL128CG70IT 制造商:SPANSION 制造商全稱(chēng):SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM50DL128CG85IS 制造商:SPANSION 制造商全稱(chēng):SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
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