參數(shù)資料
型號: AM49DL640BG35IS
廠商: Spansion Inc.
元件分類: DRAM
英文描述: Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
中文描述: 堆疊式多芯片封裝(MCP)閃存和SRAM
文件頁數(shù): 40/65頁
文件大小: 1005K
代理商: AM49DL640BG35IS
April 1, 2003
Am49DL640AG
39
P R E L I M I N A R Y
TEST CONDITIONS
Table 14.
Test Specifications
KEY TO SWITCHING WAVEFORMS
2.7 k
C
L
6.2 k
3.3 V
Device
Under
Test
Note:
Diodes are IN3064 or equivalent
Figure 12.
Test Setup
Test Condition
All Speeds
Unit
Output Load
1 TTL gate
Output Load Capacitance, C
L
(including jig capacitance)
30
pF
Input Rise and Fall Times
5
ns
Input Pulse Levels
0.0–3.0
V
Input timing measurement
reference levels
1.5
V
Output timing measurement
reference levels
1.5
V
KS000010-PAL
WAVEFORM
INPUTS
OUTPUTS
Steady
Changing from H to L
Changing from L to H
Don’t Care, Any Change Permitted
Changing, State Unknown
Does Not Apply
Center Line is High Impedance State (High Z)
3.0 V
0.0 V
1.5 V
1.5 V
Output
Measurement Level
Input
Figure 13.
Input Waveforms and Measurement Levels
相關PDF資料
PDF描述
AM49DL640BG35IT Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM49DL640BG85IS Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM49DL640BG85IT Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM49DL640BG25IS Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM49DL640BG25IT Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
相關代理商/技術參數(shù)
參數(shù)描述
AM49DL640BG35IT 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM49DL640BG40IS 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM49DL640BG40IT 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM49DL640BG70IS 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM49DL640BG70IT 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM