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參數(shù)資料
| 型號(hào)： | AM49DL32XBGB70IS |
| 廠商： | Spansion Inc. |
| 英文描述： | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous |
| 中文描述： | 堆疊式多芯片封裝（MCP）閃存和SRAM的32兆位（4個(gè)M × 8位/ 2米x 16位），3.0伏的CMOS只，同時(shí) |
| 文件頁(yè)數(shù)： | 9/64頁(yè) |
| 文件大?。?/td> | 570K |
| 代理商： | AM49DL32XBGB70IS |
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Am49DL32xBG
July 19, 2002
P R E L I M I N A R Y
PIN DESCRIPTION
A20
–
A0
= 21 Address Inputs (Common)
A-1
= 2 Address Inputs (Flash)
DQ15
–
DQ0
= 16 Data Inputs/Outputs (Common)
CE#f
= Chip Enable (Flash)
CE1#s
= Chip Enable 1 (pSRAM)
CE2s
= Chip Enable 2 (pSRAM)
OE#
= Output Enable (Common)
WE#
= Write Enable (Common)
RY/BY#
= Ready/Busy Output
UB#s
= Upper Byte Control (pSRAM)
LB#s
= Lower Byte Control (pSRAM)
CIOf
= I/O Configuration (Flash)
CIOf = V
IH
= Word mode (x16),
CIOf = V
IL
= Byte mode (x8)
= Hardware Reset Pin, Active Low
RESET#
WP#/ACC
= Hardware Write Protect/
Acceleration Pin (Flash)
V
CC
f
= Flash 3.0 volt-only single power sup-
ply (see Product Selector Guide for
speed options and voltage supply
tolerances)
V
CC
s
V
SS
NC
= pSRAM Power Supply
= Device Ground (Common)
= Pin Not Connected Internally
LOGIC SYMBOL
21
16 or 8
DQ15
–
DQ0
A20
–
A0
CE#f
OE#
WE#
RESET#
UB#s
RY/BY#
WP#/ACC
SA
A-1
LB#s
CIOf
CE1#s
CE2s
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| AM49DL32XBGB70IT | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous |
| AM49DL32XBGB85IS | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous |
| AM49DL32XBGB85IT | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous |
| AM49DL32XBGT70IS | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous |
| AM49DL32XBGT70IT | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AM49DL32XBGB70IT | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous |
| AM49DL32XBGB85IS | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous |
| AM49DL32XBGB85IT | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous |
| AM49DL32XBGT70IS | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous |
| AM49DL32XBGT70IT | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous |
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