參數(shù)資料
型號: AM49DL32XBGB70IS
廠商: Spansion Inc.
英文描述: Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous
中文描述: 堆疊式多芯片封裝(MCP)閃存和SRAM的32兆位(4個(gè)M × 8位/ 2米x 16位),3.0伏的CMOS只,同時(shí)
文件頁數(shù): 42/64頁
文件大?。?/td> 570K
代理商: AM49DL32XBGB70IS
July 19, 2002
Am49DL32xBG
41
P R E L I M I N A R Y
pSRAM AC CHARACTERISTICS
CE#s Timing
Figure 13.
Timing Diagram for Alternating
Between Pseudo SRAM to Flash
Parameter
Description
Test Setup
All Speeds
Unit
JEDEC
Std
t
CCR
CE#s Recover Time
Min
0
ns
E#f
t
CCR
t
CCR
E1#s
E2s
t
CCR
t
CCR
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AM49DL32XBGB70IT 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous
AM49DL32XBGB85IS 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous
AM49DL32XBGB85IT 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous
AM49DL32XBGT70IS 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous
AM49DL32XBGT70IT 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous