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| 型號： | AM49DL324BGB85 |
| 廠商： | Spansion Inc. |
| 英文描述： | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous |
| 中文描述： | 堆疊式多芯片封裝（MCP）閃存和SRAM的32兆位（4個M × 8位/ 2米x 16位），3.0伏的CMOS只，同時 |
| 文件頁數(shù)： | 43/64頁 |
| 文件大?。?/td> | 570K |
| 代理商： | AM49DL324BGB85 |
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42
Am49DL32xBG
July 19, 2002
P R E L I M I N A R Y
FLASH AC CHARACTERISTICS
Read-Only Operations
Notes:
1. Not 100% tested.
2. See Figure 11 and Table 19 for test specifications
3. Measurements performed by placing a 50
termination on the data pin with a bias of V
CC
/2. The time from OE# high to the
data bus driven to V
CC
/2 is taken as t
DF
.
Parameter
Description
Test Setup
Speed
JEDEC
Std.
70
85
Unit
t
AVAV
t
RC
Read Cycle Time (Note 1)
Min
70
85
ns
t
AVQV
t
ACC
Address to Output Delay
CE#f, OE# = V
IL
Max
70
85
ns
t
ELQV
t
CE
Chip Enable to Output Delay
OE# = V
IL
Max
70
85
ns
t
GLQV
t
OE
Output Enable to Output Delay
Max
30
40
ns
t
EHQZ
t
DF
Chip Enable to Output High Z (Notes 1, 3)
Max
30
35
ns
t
GHQZ
t
DF
Output Enable to Output High Z (Notes 1, 3)
Max
30
ns
t
AXQX
t
OH
Output Hold Time From Addresses, CE#f or
OE#, Whichever Occurs First
Min
0
ns
t
OEH
Output Enable Hold Time
(Note 1)
Read
Min
0
ns
Toggle and
Data# Polling
Min
10
ns
t
OH
t
CE
Outputs
WE#
Addresses
CE#f
OE#
HIGH Z
Output Valid
HIGH Z
Addresses Stable
t
ACC
t
RC
t
OEH
t
RH
t
OE
t
RH
0 V
RY/BY#
RESET#
t
DF
Figure 14.
Read Operation Timings
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| AM49DL324BGT70 | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous |
| AM49DL324BGT85 | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous |
| AM49DL32XBGB70IS | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous |
| AM49DL32XBGB70IT | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous |
| AM49DL32XBGB85IS | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AM49DL324BGB85S | 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 32 Mbit (2M x 16-Bit) |
| AM49DL324BGB85T | 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 32 Mbit (2M x 16-Bit) |
| AM49DL324BGT70 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous |
| AM49DL324BGT70S | 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 32 Mbit (2M x 16-Bit) |
| AM49DL324BGT70T | 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 32 Mbit (2M x 16-Bit) |
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