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參數(shù)資料
| 型號(hào)： | AM49DL322BGB70 |
| 廠商： | Spansion Inc. |
| 英文描述： | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous |
| 中文描述： | 堆疊式多芯片封裝（MCP）閃存和SRAM的32兆位（4個(gè)M × 8位/ 2米x 16位），3.0伏的CMOS只，同時(shí) |
| 文件頁(yè)數(shù)： | 61/64頁(yè) |
| 文件大?。?/td> | 570K |
| 代理商： | AM49DL322BGB70 |
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60
Am49DL32xBG
July 19, 2002
P R E L I M I N A R Y
pSRAM DATA RETENTION
Notes:
1. CE1#s
≥
V
CC
–
0.2 V, CE2s
≥
V
CC
–
0.2 V (CE1#s controlled) or CE2s
≤
0.2 V (CE2s controlled).
2. Typical values are not 100% tested.
pSRAM POWER ON AND DEEP POWER DOWN
Figure 33.
Deep Power-down Timing
Note:
Data cannot be retained during deep power-down standby mode.
Figure 34.
Power-on Timing
Parameter
Symbol
Parameter Description
Test Setup
Min
Typ
Max
Unit
V
DR
V
CC
for Data Retention
CS1#s
≥
V
CC
–
0.2 V (Note 1)
V
CC
= 3.0 V, CE1#s
≥
V
CC
–
0.2 V
(Note 1)
2.7
3.3
V
I
DR
Data Retention Current
1.0
(Note 2)
70
μA
t
CS
t
CH
t
DPD
t
CHC
t
CHP
CE2 Setup Time
0
ns
CE2 Hold Time
300
μs
CE2 Pulse Width
10
ms
CE2 Hold from CE#1
0
ns
CE2 Hold from Power On
30
μs
CE#1
CE#2
t
DPD
t
CH
tcs
CE#1
V
DD
CE#2
t
CHC
t
CHP
t
CH
V
DD min
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| AM49DL322BGB85 | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous |
| AM49DL322BGT70 | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous |
| AM49DL322BGT85 | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous |
| AM49DL323BGB70 | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous |
| AM49DL323BGB85 | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AM49DL322BGB70S | 制造商:AMD 制造商全稱(chēng):Advanced Micro Devices 功能描述:32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 32 Mbit (2M x 16-Bit) |
| AM49DL322BGB70T | 制造商:AMD 制造商全稱(chēng):Advanced Micro Devices 功能描述:32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 32 Mbit (2M x 16-Bit) |
| AM49DL322BGB85 | 制造商:SPANSION 制造商全稱(chēng):SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous |
| AM49DL322BGB85S | 制造商:AMD 制造商全稱(chēng):Advanced Micro Devices 功能描述:32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 32 Mbit (2M x 16-Bit) |
| AM49DL322BGB85T | 制造商:AMD 制造商全稱(chēng):Advanced Micro Devices 功能描述:32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 32 Mbit (2M x 16-Bit) |
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