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| 型號： | AM49DL322BGB70 |
| 廠商： | Spansion Inc. |
| 英文描述： | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous |
| 中文描述： | 堆疊式多芯片封裝（MCP）閃存和SRAM的32兆位（4個M × 8位/ 2米x 16位），3.0伏的CMOS只，同時 |
| 文件頁數(shù)： | 5/64頁 |
| 文件大小： | 570K |
| 代理商： | AM49DL322BGB70 |
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4
Am49DL32xBG
July 19, 2002
P R E L I M I N A R Y
Package Pin Capacitance . . . . . . . . . . . . . . . . . . 59
Flash Data Retention . . . . . . . . . . . . . . . . . . . . . . 59
pSRAM Data Retention . . . . . . . . . . . . . . . . . . . . .60
pSRAM Power on and Deep Power Down . . . . . 60
Figure 33. Deep Power-down Timng.............................................. 60
Figure 34. Power-on Timng............................................................ 60
pSRAM Address Skew . . . . . . . . . . . . . . . . . . . . .61
Figure 35. Read Address Skew..................................................... 61
Figure 36. Write Address Skew...................................................... 61
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 62
FLB073
—
73-Ball Fine-Pitch Grid Array 8 x 11.6 mm.............62
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 63
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| AM49DL322BGB85 | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous |
| AM49DL322BGT70 | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous |
| AM49DL322BGT85 | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous |
| AM49DL323BGB70 | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous |
| AM49DL323BGB85 | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AM49DL322BGB70S | 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 32 Mbit (2M x 16-Bit) |
| AM49DL322BGB70T | 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 32 Mbit (2M x 16-Bit) |
| AM49DL322BGB85 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous |
| AM49DL322BGB85S | 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 32 Mbit (2M x 16-Bit) |
| AM49DL322BGB85T | 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 32 Mbit (2M x 16-Bit) |
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