參數(shù)資料
型號(hào): AM42DL6404G85IT
廠(chǎng)商: SPANSION LLC
元件分類(lèi): 存儲(chǔ)器
英文描述: Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
中文描述: SPECIALTY MEMORY CIRCUIT, PBGA73
封裝: 8 X 11.60 MM, FBGA-73
文件頁(yè)數(shù): 2/61頁(yè)
文件大?。?/td> 567K
代理商: AM42DL6404G85IT
PRELIMINARY
This document contains information on a product under development at Advanced Micro Devices. The information
is intended to help you evaluate this product. AMD reserves the right to change or discontinue work on this proposed
product without notice.
Refer to AMD’s Website (www.amd.com) for the latest information.
Publication#
26092
Issue Date:
March 20, 2002
Rev:
A
Amendment/
+1
Am42DL6404G
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
Am29DL640G 64 Megabit (8 M x 8-Bit/4 M x 16-Bit) CMOS 3.0 Volt-only,
Simultaneous Operation Flash Memory and 4 Mbit (256 K x 16-Bit) Static RAM
DISTINCTIVE CHARACTERISTICS
MCP Features
Power supply voltage of 2.7 to 3.3 volt
I
I
High performance
— Access time as fast as 70 ns
Package
— 73-Ball FBGA
Operating Temperature
— –40°C to +85°C
I
I
Flash Memory Features
ARCHITECTURAL ADVANTAGES
Simultaneous Read/Write operations
— Data can be continuously read from one bank while
executing erase/program functions in another bank.
— Zero latency between read and write operations
I
Flexible Bank
architecture
— Read may occur in any of the three banks not being written
or erased.
— Four banks may be grouped by customer to achieve desired
bank divisions.
I
Manufactured on 0.17 μm process technology
SecSi (Secured Silicon) Sector: Extra 256 Byte sector
Factory locked and identifiable:
16 bytes available for
secure, random factory Electronic Serial Number; verifiable
as factory locked through autoselect function. ExpressFlash
option allows entire sector to be available for
factory-secured data
Customer lockable:
Sector is one-time programmable. Once
sector is locked, data cannot be changed.
I
Zero Power Operation
Sophisticated power management circuits reduce power
consumed during inactive periods to nearly zero.
I
Boot sectors
Top and bottom boot sectors in the same device
I
Compatible with JEDEC standards
Pinout and software compatible with single-power-supply
flash standard
I
I
PERFORMANCE CHARACTERISTICS
High performance
Access time as fast as 70 ns
Program time: 4 μs/word typical utilizing Accelerate function
I
Ultra low power consumption (typical values)
2 mA active read current at 1 MHz
10 mA active read current at 5 MHz
200 nA in standby or automatic sleep mode
I
I
Minimum 1 million write cycles guaranteed per sector
20 year data retention at 125
°
C
Reliable operation for the life of the system
I
SOFTWARE FEATURES
Data Management Software (DMS)
AMD-supplied software manages data programming,
enabling EEPROM emulation
Eases historical sector erase flash limitations
I
Supports Common Flash Memory Interface (CFI)
I
I
Program/Erase Suspend/Erase Resume
Suspends program/erase operations to allow
programming/erasing in same bank
Data# Polling and Toggle Bits
Provides a software method of detecting the status of
program or erase cycles
Unlock Bypass Program command
Reduces overall programming time when issuing multiple
program command sequences
I
I
HARDWARE FEATURES
Any combination of sectors can be erased
I
I
Ready/Busy# output (RY/BY#)
Hardware method for detecting program or erase cycle
completion
Hardware reset pin (RESET#)
Hardware method of resetting the internal state machine to
the read mode
WP#/ACC input pin
Write protect (WP#) function protects sectors 0, 1, 140, and
141, regardless of sector protect status
Acceleration (ACC) function accelerates program timing
Sector protection
Hardware method of locking a sector, either in-system or
using programming equipment, to prevent any program or
erase operation within that sector
Temporary Sector Unprotect allows changing data in
protected sectors in-system
I
I
I
SRAM Features
Power dissipation
Operating: 22 mA maximum
Standby: 10 μA maximum
I
CE1s# and CE2s Chip Select
Power down features using CE1s# and CE2s
Data retention supply voltage: 1.5 to 3.3 volt
Byte data control: LB#s (DQ7
DQ0), UB#s (DQ15
DQ8)
I
I
I
I
相關(guān)PDF資料
PDF描述
AM42DL640AH70IS 64 Megabit (4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 16 Mbit (1 M x 16-Bit) Static RAM
AM42DL640AH70IT 64 Megabit (4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 16 Mbit (1 M x 16-Bit) Static RAM
AM42DL640AH85IS 64 Megabit (4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 16 Mbit (1 M x 16-Bit) Static RAM
AM42DL640AH85IT 64 Megabit (4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 16 Mbit (1 M x 16-Bit) Static RAM
AM49DL322BGB70 Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
AM42DL6408G70I 制造商:Spansion 功能描述:64M (X8/X16) FLASH, 8M (X16) SRAM, 3V, FBGA73, IND - Trays
AM42DL640AG 制造商:AMD 制造商全稱(chēng):Advanced Micro Devices 功能描述:64 Megabit (8 M x 8-Bit/4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 16 Mbit (1 M x 16-Bit) Static RAM
AM42DL640AG25IT 制造商:AMD 制造商全稱(chēng):Advanced Micro Devices 功能描述:64 Megabit (8 M x 8-Bit/4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 16 Mbit (1 M x 16-Bit) Static RAM
AM42DL640AG30IT 制造商:AMD 制造商全稱(chēng):Advanced Micro Devices 功能描述:64 Megabit (8 M x 8-Bit/4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 16 Mbit (1 M x 16-Bit) Static RAM
AM42DL640AG35IT 制造商:AMD 制造商全稱(chēng):Advanced Micro Devices 功能描述:64 Megabit (8 M x 8-Bit/4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 16 Mbit (1 M x 16-Bit) Static RAM