參數(shù)資料
型號(hào): AM41DL6408H
廠商: Advanced Micro Devices, Inc.
元件分類: SRAM
英文描述: Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
中文描述: 堆疊式多芯片封裝(MCP)閃存和SRAM
文件頁(yè)數(shù): 9/66頁(yè)
文件大?。?/td> 1123K
代理商: AM41DL6408H
November 24, 2003
Am41DL6408H
7
A D V A N C E I N F O R M A T I O N
CONNECTION DIAGRAM
Special Package Handling Instructions
Special handling is required for Flash Memory prod-
ucts in molded packages (FBGA). The package and/or
data integrity may be compromised if the package
body is exposed to temperatures above 150C for pro-
longed periods of time.
A1
B1
C1
F1
G1
L1
M1
D2
E2
F2
G2
H2
J2
C3
D3
E3
F3
G3
H3
J3
K3
C4
D4
E4
F4
G4
H4
J4
K4
B5
C5
D5
E5
H5
J5
K5
L5
B6
C6
D6
E6
H6
J6
K6
L6
C7
D7
E7
F7
G7
H7
J7
K7
C8
D8
E8
F8
G8
H8
J8
K8
D9
E9
F9
G9
H9
J9
A10
B10
F10
G10
L10
M10
NC
NC
NC
NC
NC
NC
NC
NC
NC
A3
A2
A1
A0
CE#f
CE1#s
A7
A6
A5
A4
V
SS
OE#
DQ0
DQ8
LB#
UB#
A18
A17
DQ1
DQ9
DQ10
DQ2
NC
WP#/ACC
RESET#
RY/BY#
DQ3
V
f
DQ11
NC
WE#
CE2s
A20
DQ4
V
CC
s
CIOs
A8
A19
A9
A10
DQ6
DQ13
DQ12
DQ5
A11
A12
A13
A14
SA
DQ15/A-1
DQ7
DQ14
A15
A21
NC
A16
CIOf
V
SS
NC
NC
NC
NC
NC
NC
SRAM only
Shared
Flash only
73-Ball FBGA
Top View
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PDF描述
AM41DL6408H8H70IS TV 6C 6#20 PIN WALL RECP
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AM41DL6408H8H85IS Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
AM41DL6408H8H70IS 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM41DL6408H8H70IT 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM41DL6408H8H71IS 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM41DL6408H8H71IT 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM41DL6408H8H85IS 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM