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參數(shù)資料
| 型號： | AM41DL6408H |
| 廠商： | Advanced Micro Devices, Inc. |
| 元件分類： | SRAM |
| 英文描述： | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| 中文描述： | 堆疊式多芯片封裝（MCP）閃存和SRAM |
| 文件頁數(shù)： | 44/66頁 |
| 文件大?。?/td> | 1123K |
| 代理商： | AM41DL6408H |
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42
Am41DL6408H
November 24, 2003
A D V A N C E I N F O R M A T I O N
AC CHARACTERISTICS
Flash Read-Only Operations
Notes:
1. Not 100% tested.
2. See Figure 12 and Table 16 for test specifications
3. Measurements performed by placing a 50
termination on the data pin with a bias of V
CC
/2. The time from OE# high to the
data bus driven to V
CC
/2 is taken as t
DF
.
Parameter
Description
Test Setup
Speed
JEDEC
Std.
70, 71
85
Unit
t
AVAV
t
RC
Read Cycle Time (Note 1)
Min
70
85
ns
t
AVQV
t
ACC
Address to Output Delay
CE#f, OE# = V
IL
Max
70
85
ns
t
ELQV
t
CE
Chip Enable to Output Delay
OE# = V
IL
Max
70
85
ns
t
GLQV
t
OE
Output Enable to Output Delay
Max
30
40
ns
t
EHQZ
t
DF
Chip Enable to Output High Z (Notes 1, 3)
Max
30
ns
t
GHQZ
t
DF
Output Enable to Output High Z (Notes 1, 3)
Max
30
ns
t
AXQX
t
OH
Output Hold Time From Addresses, CE#f or
OE#, Whichever Occurs First
Min
0
ns
t
OEH
Output Enable Hold Time
(Note 1)
Read
Min
0
ns
Toggle and
Data# Polling
Min
10
ns
t
OH
t
CE
Outputs
WE#
Addresses
CE#f
OE#
HIGH Z
Output Valid
HIGH Z
Addresses Stable
t
RC
t
ACC
t
OEH
t
RH
t
OE
t
RH
0 V
RY/BY#
RESET#
t
DF
Figure 15.
Read Operation Timings
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| AM41DL6408H8H70IT | TV 6C 6#20 PIN WALL RECP |
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| AM41DL6408H8H70IS | 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM41DL6408H8H70IT | 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM41DL6408H8H71IS | 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM41DL6408H8H71IT | 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM41DL6408H8H85IS | 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
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