參數(shù)資料
型號(hào): AM41DL6408H8H70IS
廠商: Advanced Micro Devices, Inc.
英文描述: TV 6C 6#20 PIN WALL RECP
中文描述: 堆疊式多芯片封裝(MCP)閃存和SRAM
文件頁(yè)數(shù): 42/66頁(yè)
文件大小: 1123K
代理商: AM41DL6408H8H70IS
40
Am41DL6408H
November 24, 2003
A D V A N C E I N F O R M A T I O N
TEST CONDITIONS
Table 16.
Test Specifications
KEY TO SWITCHING WAVEFORMS
2.7 k
C
L
6.2 k
3.3 V
Device
Under
Test
Note:
Diodes are IN3064 or equivalent
Figure 12.
Test Setup
Test Condition
All Speeds
Unit
Output Load
1 TTL gate
Output Load Capacitance, C
L
(including jig capacitance)
30
pF
Input Rise and Fall Times
5
ns
Input Pulse Levels
0.0–3.0
V
Input timing measurement
reference levels
1.5
V
Output timing measurement
reference levels
1.5
V
KS000010-PAL
WAVEFORM
INPUTS
OUTPUTS
Steady
Changing from H to L
Changing from L to H
Don’t Care, Any Change Permitted
Changing, State Unknown
Does Not Apply
Center Line is High Impedance State (High Z)
3.0 V
0.0 V
1.5 V
1.5 V
Output
Measurement Level
Input
Figure 13.
Input Waveforms and Measurement Levels
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
AM41DL6408H8H70IT 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM41DL6408H8H71IS 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM41DL6408H8H71IT 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM41DL6408H8H85IS 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM41DL6408H8H85IT 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM