參數(shù)資料
型號(hào)： AM29LV640MU101RPCI
廠商： ADVANCED MICRO DEVICES INC
元件分類： PROM
英文描述： 64 Megabit (4 M x 16-Bit) MirrorBit 3.0 Volt-only Uniform Sector Flash Memory with
中文描述： 4M X 16 FLASH 3V PROM, 100 ns, PBGA64
封裝： 13 X 11 MM, 1 MM PITCH, BGA-64
文件頁(yè)數(shù)： 5/58頁(yè)
文件大?。?/td> 1170K
代理商： AM29LV640MU101RPCI
4
Am29LV640MU
June 12, 2003
A D V A N C E I N F O R M A T I O N
TABLE OF CONTENTS
MirrorBit 64 Mbit Device Family . . . . . . . . . . . . . . 3
Table of Contents. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Product Selector Guide. . . . . . . . . . . . . . . . . . . . . 5
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . 6
Special Package Handling Instructions ....................................7
Pin Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Ordering Information. . . . . . . . . . . . . . . . . . . . . . . 9
Device Bus Operations . . . . . . . . . . . . . . . . . . . . 10
Table 1. Device Bus Operations .....................................................10
VersatileIO
(V
IO
) Control .....................................................10
Requirements for Reading Array Data ...................................10
Page Mode Read ....................................................................11
Writing Commands/Command Sequences ............................11
Write Buffer .............................................................................11
Accelerated ProgramOperation .............................................11
Autoselect Functions ..............................................................11
Standby Mode........................................................................ 11
Automatic Sleep Mode ...........................................................11
RESET# Hardware Reset Pin ...............................................12
Output Disable Mode ..............................................................12
Table 2. Sector Address Table ........................................................13
Autoselect Mode..................................................................... 15
Table 3. Autoselect Codes, (High Voltage Method) .......................15
Sector Group Protection and Unprotection .............................16
Table 4. Sector Group Protection/Unprotection AddressTable .....16
Temporary Sector Group Unprotect .......................................17
Figure 1. Temporary Sector Group UnprotectOperation................ 17
Figure 2. In-SystemSector Group Protect/UnprotectAlgorithms... 18
SecSi (Secured Silicon) Sector Flash MemoryRegion ..........19
Table 5. SecSi Sector Contents ......................................................19
Figure 3. SecSi Sector Protect Verify.............................................. 20
Hardware Data Protection ......................................................20
Low VCC Write Inhibit ............................................................20
Write Pulse “Glitch” Protection ...............................................20
Logical Inhibit ..........................................................................20
Power-Up Write Inhibit ............................................................20
Common Flash Memory Interface (CFI). . . . . . . 21
Table 6. CFI Query Identification String.............................. 21
Table 7. SystemInterface String......................................................21
Table 8. Device Geometry Definition................................... 22
Table 9. Primary Vendor-Specific Extended Query............. 23
Command Definitions . . . . . . . . . . . . . . . . . . . . . 24
Reading Array Data ................................................................24
Reset Command .....................................................................24
Autoselect Command Sequence ............................................24
Enter SecSi Sector/Exit SecSi Sector CommandSequence ..25
Word ProgramCommand Sequence .....................................25
Unlock Bypass Command Sequence .....................................25
Write Buffer Programmng ......................................................25
Accelerated Program..............................................................26
Figure 4. Write Buffer Programmng Operation............................... 27
Figure 5. ProgramOperation.......................................................... 28
ProgramSuspend/ProgramResume Command Sequence ...28
Figure 6. ProgramSuspend/ProgramResume............................... 29
Chip Erase Command Sequence ...........................................29
Sector Erase Command Sequence ........................................29
Erase Suspend/Erase Resume Commands ...........................30
Figure 7. Erase Operation.............................................................. 30
Command Definitions............................................................. 31
Table 10. Command Definitions......................................................31
Write Operation Status. . . . . . . . . . . . . . . . . . . . . 32
DQ7: Data#Polling .................................................................32
Figure 8. Data#Polling Algorithm.................................................. 32
RY/BY# Ready/Busy#........................................................... 33
DQ6: Toggle Bit I ....................................................................33
Figure 9. Toggle Bit Algorithm....................................................... 34
DQ2: Toggle Bit II ...................................................................34
Reading Toggle Bits DQ6/DQ2 ...............................................34
DQ5: Exceeded Timng Limts ................................................35
DQ3: Sector Erase Timer .......................................................35
DQ1: Write-to-Buffer Abort .....................................................35
Table 11. Write Operation Status ...................................................35
Absolute Maximum Ratings. . . . . . . . . . . . . . . . . 36
Figure 10. MaximumNegative OvershootWaveform................... 36
Figure 11. MaximumPositive OvershootWaveform..................... 36
Operating Ranges. . . . . . . . . . . . . . . . . . . . . . . . . 36
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 37
Test Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Figure 12. Test Setup.................................................................... 38
Table 12. Test Specifications .........................................................38
Key to Switching Waveforms. . . . . . . . . . . . . . . . 38
Figure 13. Input Waveforms and
Measurement Levels...................................................................... 38
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 39
Read-Only Operations ...........................................................39
Figure 14. Read Operation Timngs............................................... 39
Figure 15. Page Read Timngs...................................................... 40
Hardware Reset (RESET#) ....................................................41
Figure 16. Reset Timngs............................................................... 41
Erase and ProgramOperations ..............................................42
Figure 17. ProgramOperation Timngs.......................................... 43
Figure 18. Accelerated ProgramTimng Diagram.......................... 43
Figure 19. Chip/Sector Erase Operation Timngs.......................... 44
Figure 20. Data#Polling Timngs
(During Embedded Algorithms)...................................................... 45
Figure 21. Toggle Bit Timngs
(During Embedded Algorithms)...................................................... 46
Figure 22. DQ2 vs. DQ6................................................................. 46
Temporary Sector Unprotect ..................................................47
Figure 23. Temporary Sector Group Unprotect TimngDiagram... 47
Figure 24. Sector Group Protect and Unprotect TimngDiagram.. 48
Alternate CE#Controlled Erase and ProgramOperations .....49
Figure 25. Alternate CE#Controlled Write (Erase/Program
OperationTimngs.......................................................................... 50
Erase And Programming Performance. . . . . . . . 51
Latchup Characteristics. . . . . . . . . . . . . . . . . . . . 51
TSOP Pin and FIne-pitch BGA Package
Capacitance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 53
LAA064—64-Ball Fortified Ball Grid Array (
F
BGA)
13x11mmPackage ..............................................................53
FBE063—63-Ball Fine-Pitch Ball Grid Array (FBGA)
12x11mmPackage ..............................................................54
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 55
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