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Am29DS163D
A D V A N C E I N F O R M A T I O N
REVISION SUMMARY
Revision A (November 9, (2000)
Initial release.
Revision A+1 (November 8, 2004)
Global
Added cover page
Added Colophon
Updated Trademark
Added referenced links.
Ordering Information
Added temperature range for Pb-free Packages
Valid Combinations for FBGA Packages
Added new order number information
Added new Package Marking information
Colophon
The products described in this document are designed, developed and manufactured as contemplated for general use, including without limita-
tion, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as con-
templated (1) for
any
use
that includes
fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the
public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility,
aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2)
for
any use where chance of failure is intolerable
(i.e., submersible repeater and artificial satellite). Please note that Spansion LLC will not be liable
to
you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor
devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design
measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operat-
ing conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the
Foreign Exchange and Foreign Trade Law of Japan
, the US Export Administration Regulations or the applicable laws of any other country,
the
prior authorization by
the respective government entity
will be required for export of those products.
Trademarks
Copyright 2000-2004 Advanced Micro Devices, Inc. All rights reserved.
AMD, the AMD logo, and combinations thereof are registered trademarks of Advanced Micro Devices, Inc.
ExpressFlash is a trademark of Advanced Micro Devices, Inc.
Product names used in this publication are for identification purposes only and may be trademarks of their respective companies.