參數(shù)資料
型號： AM29DS163DB100WAF
廠商： Advanced Micro Devices, Inc.
英文描述： 16 Megabit CMOS 1.8 Volt-only, Simultaneous Operation Flash Memory
中文描述： 16兆位的CMOS 1.8伏只，同時(shí)作業(yè)快閃記憶體
文件頁數(shù)： 5/50頁
文件大?。?/td> 1682K
代理商： AM29DS163DB100WAF
Am29DS163D
5
A D V A N C E I N F O R M A T I O N
TABLE OF CONTENTS
Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 6
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . .7
Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
Ordering Information . . . . . . . . . . . . . . . . . . . . . . .9
Device Bus Operations . . . . . . . . . . . . . . . . . . . . .10
Table 1. Am29DS163D Device Bus Operations .............................10
Word/Byte Configuration ........................................................10
Requirements for Reading Array Data ...................................10
Writing Commands/Command Sequences ............................11
Accelerated ProgramOperation ......................................................11
Autoselect Functions .......................................................................11
Simultaneous Read/Write Operations with Zero Latency .......11
Standby Mode ........................................................................11
Automatic Sleep Mode ...........................................................12
RESET#: Hardware Reset Pin ...............................................12
Output Disable Mode ..............................................................12
Table 2. Am29DS163D Device Bank Divisions ...............................12
Table 3. Top Boot Sector Addresses (Am29DS16xDT) ..................13
SecSi Sector Addresses for Top Boot Devices.............................. 13
Table 5. BottomBoot Sector Addresses (Am29DS16xDB) ............14
SecSi Sector Addresses for BottomBoot Devices......................... 14
Autoselect Mode .....................................................................15
Table 7. Am29DS163D Autoselect Codes (High Voltage Method) 15
Sector/Sector Block Protection and Unprotection ..................16
Table 8. Top Boot Sector/Sector Block Addresses
for Protection/Unprotection .............................................................16
Table 9. BottomBoot Sector/Sector Block Addresses
for Protection/Unprotection .............................................................16
Write Protect (WP#) ................................................................17
Temporary Sector/Sector Block Unprotect .............................17
Figure 1. Temporary Sector Unprotect Operation........................... 17
Figure 2. In-SystemSector/Sector Block Protect
and Unprotect Algorithms................................................................ 18
SecSi (Secured Silicon) Sector Flash Memory Region ..........19
Hardware Data Protection ......................................................19
Low VCC Write Inhibit .....................................................................20
Write Pulse “Glitch” Protection ........................................................20
Logical Inhibit ..................................................................................20
Power-Up Write Inhibit ....................................................................20
Common Flash Memory Interface (CFI) . . . . . . . 20
Table 10. CFI Query Identification String........................................ 20
SystemInterface String................................................................... 21
Table 12. Device Geometry Definition............................................ 21
Table 13. Primary Vendor-Specific Extended Query...................... 22
Command Definitions . . . . . . . . . . . . . . . . . . . . . .23
Reading Array Data ................................................................23
Reset Command .....................................................................23
Autoselect Command Sequence ............................................23
Enter SecSi Sector/Exit SecSi Sector Command Sequence ..24
Byte/Word ProgramCommand Sequence .............................24
Unlock Bypass Command Sequence ..............................................24
Figure 3. ProgramOperation.......................................................... 25
Chip Erase Command Sequence ...........................................25
Sector Erase Command Sequence ........................................25
Erase Suspend/Erase Resume Commands ...........................26
Figure 4. Erase Operation.............................................................. 26
Table 14. Am29DS163D Command Definitions.............................. 27
Write Operation Status . . . . . . . . . . . . . . . . . . . . 28
DQ7: Data#Polling .................................................................28
Figure 5. Data#Polling Algorithm.................................................. 28
RY/BY#: Ready/Busy#............................................................29
DQ6: Toggle Bit I ....................................................................29
Figure 6. Toggle Bit Algorithm........................................................ 29
DQ2: Toggle Bit II ...................................................................30
Reading Toggle Bits DQ6/DQ2 ...............................................30
DQ5: Exceeded Timng Limts ................................................30
DQ3: Sector Erase Timer .......................................................30
Table 15. Write Operation Status ...................................................31
Absolute Maximum Ratings . . . . . . . . . . . . . . . . 32
Figure 7. MaximumNegative Overshoot Waveform...................... 32
Figure 8. MaximumPositive Overshoot Waveform....................... 32
Operating Ranges. . . . . . . . . . . . . . . . . . . . . . . . . 32
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 33
Figure 9. I
CC1
Current vs. Time (Showing Active
and Automatic Sleep Currents)...................................................... 34
Figure 10. Typical I
CC1
vs. Frequency............................................ 34
Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Figure 11. Test Setup.................................................................... 35
Table 16. Test Specifications .........................................................35
Figure 12. Input Waveforms and Measurement Levels................. 35
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 36
Figure 13. Read Operation Timngs............................................... 36
Figure 14. Reset Timngs............................................................... 37
Word/Byte Configuration (BYTE#) ..........................................38
Figure 15. BYTE#Timngs for Read Operations............................ 38
Figure 16. BYTE#Timngs for Write Operations............................ 38
Erase and ProgramOperations ..............................................39
Figure 17. ProgramOperation Timngs.......................................... 40
Figure 18. Accelerated ProgramTimng Diagram.......................... 40
Figure 19. Chip/Sector Erase Operation Timngs.......................... 41
Figure 20. Back-to-back Read/Write Cycle Timngs...................... 42
Figure 21. Data# Polling Timngs (During Embedded Algorithms). 42
Figure 22. Toggle Bit Timngs (During Embedded Algorithms)...... 43
Figure 23. DQ2 vs. DQ6................................................................. 43
Temporary Sector/Sector Block Unprotect .............................44
Figure 24. Temporary Sector/Sector Block
Unprotect Timng Diagram............................................................. 44
Figure 25. Sector/Sector Block Protect/Unprotect Timng Diagram 45
Alternate CE#Controlled Erase and ProgramOperations .....46
Figure 26. Alternate CE#Controlled Write
(Erase/Program Operation Timngs.............................................. 47
Erase And Programming Performance . . . . . . . 48
Latchup Characteristics. . . . . . . . . . . . . . . . . . . . 48
Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 49
FBA048—48-Ball Fine-Pitch Ball Grid Array (FBGA)
6 x 8 mmpackage .................................................................49
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 50
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