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參數資料

型號：	AM29DL322GT70WMIN
廠商：	ADVANCED MICRO DEVICES INC
元件分類：	PROM
英文描述：	2M X 16 FLASH 3V PROM, 70 ns, PBGA48
封裝：	6 X 12 MM, 0.80 MM PITCH, FBGA-48
文件頁數：	23/53頁
文件大?。?/td>	1448K
代理商：	AM29DL322GT70WMIN

March 26, 2004

Am29DL32xG

AD V A NCE

I N FO RM ATI O N

TABLE OF CONTENTS

Product Selector Guide . . . . . . . . . . . . . . . . . . . . . .4

Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . .5

Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7

Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7

Ordering Information . . . . . . . . . . . . . . . . . . . . . . . .8

Device Bus Operations . . . . . . . . . . . . . . . . . . . . . . 10

Table 1. Device Bus Operations ......................................................... 10

Word/Byte Configuration .................................................................................10

Requirements for Reading Array Data ......................................................... 10

Writing Commands/Command Sequences .................................................. 11

Accelerated Program Operation ................................................................ 11

Autoselect Functions ...................................................................................... 11

Simultaneous Read/Write Operations with Zero Latency ..................... 11

Standby Mode .........................................................................................................11

Automatic Sleep Mode ....................................................................................... 11

RESET#: Hardware Reset Pin ......................................................................... 12

Output Disable Mode ........................................................................................ 12

Table 2. Device Bank Divisions .......................................................... 12

Table 3. Top Boot Sector Addresses ................................................. 13

Table 4. Top Boot SecSiTM Sector Addresses...................................... 14

Table 5. Bottom Boot SecSiTM Sector Addresses................................. 14

Autoselect Mode ..................................................................................................15

Table 6. Autoselect Codes, (High Voltage Method) .............................15

Sector/Sector Block Protection and Unprotection ...................................16

Table 7. Top Boot Sector/Sector Block Addresses

for Protection/Unprotection ...............................................................16

Table 8. Bottom Boot Sector/Sector Block Addresses

for Protection/Unprotection ...............................................................16

Write Protect (WP#) .........................................................................................17

Temporary Sector Unprotect ..........................................................................17

Figure 1. Temporary Sector Unprotect Operation ............................... 17

Figure 2. In-System Sector Protection/ Sector Unprotection

Algorithms....................................................................................... 18

SecSiTM (Secured Silicon) Sector Flash Memory Region ......................... 19

Factory Locked: SecSi Sector Programmed and Protected At

the Factory ........................................................................................................ 19

Customer Lockable: SecSi Sector NOT Programmed or

Protected At the Factory ............................................................................. 19

Hardware Data Protection .............................................................................. 19

Low VCC Write Inhibit ............................................................................... 20

Write Pulse “Glitch” Protection ............................................................... 20

Logical Inhibit .................................................................................................. 20

Power-Up Write Inhibit ............................................................................... 20

Common Flash Memory Interface (CFI) . . . . . . .20

Table 9. CFI Query Identification String.............................................. 20

Table 10. System Interface String...................................................... 21

Table 11. Device Geometry Definition................................................. 21

Table 12. Primary Vendor-Specific Extended Query............................. 22

Command Definitions . . . . . . . . . . . . . . . . . . . . . .22

Reading Array Data ........................................................................................... 22

Reset Command ..................................................................................................23

Autoselect Command Sequence ....................................................................23

Enter SecSiTM Sector/Exit SecSi Sector Command Sequence ...............23

Byte/Word Program Command Sequence .................................................23

Unlock Bypass Command Sequence ........................................................ 24

Figure 3. Program Operation............................................................. 24

Chip Erase Command Sequence ...................................................................24

Sector Erase Command Sequence ................................................................ 25

Erase Suspend/Erase Resume Commands .................................................. 25

Figure 4. Erase Operation.................................................................. 26

Table 13. Command Definitions......................................................... 27

Write Operation Status . . . . . . . . . . . . . . . . . . . . . 28

DQ7: Data# Polling ............................................................................................28

Figure 5. Data# Polling Algorithm...................................................... 28

RY/BY#: Ready/Busy# ....................................................................................... 29

DQ6: Toggle Bit I ...............................................................................................29

Figure 6. Toggle Bit Algorithm........................................................... 29

DQ2: Toggle Bit II ..............................................................................................30

Reading Toggle Bits DQ6/DQ2 .....................................................................30

DQ5: Exceeded Timing Limits ........................................................................30

DQ3: Sector Erase Timer ................................................................................30

Table 14. Write Operation Status .......................................................31

Absolute Maximum Ratings . . . . . . . . . . . . . . . . . 32

Figure 7. Maximum Negative Overshoot Waveform............................ 32

Figure 8. Maximum Positive Overshoot Waveform.............................. 32

DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 33

Figure 9. ICC1 Current vs. Time (Showing Active and Automatic

Sleep Currents)................................................................................ 34

Figure 10. Typical ICC1 vs. Frequency................................................. 34

Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

Figure 11. Test Setup....................................................................... 35

Figure 12. Input Waveforms and Measurement Levels........................ 35

AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 36

Figure 13. Read Operation Timings.................................................... 36

Figure 14. Reset Timings................................................................... 37

Word/Byte Configuration (BYTE#) ..............................................................38

Figure 15. BYTE# Timings for Read Operations................................... 38

Figure 16. BYTE# Timings for Write Operations.................................. 38

Erase and Program Operations ...................................................................... 39

Figure 17. Program Operation Timings............................................... 40

Figure 18. Accelerated Program Timing Diagram................................ 40

Figure 19. Chip/Sector Erase Operation Timings................................. 41

Figure 20. Back-to-back Read/Write Cycle Timings............................. 42

Figure 21. Data# Polling Timings (During Embedded Algorithms)........ 42

Figure 22. Toggle Bit Timings (During Embedded Algorithms) ............ 43

Figure 23. DQ2 vs. DQ6.................................................................... 43

Temporary Sector Unprotect ........................................................................44

Figure 24. Temporary Sector Unprotect Timing Diagram..................... 44

Figure 25. Sector/Sector Block Protect and Unprotect Timing

Diagram .......................................................................................... 45

Alternate CE# Controlled Erase and Program Operations .................46

Figure 26. Alternate CE# Controlled Write (Erase/Program)

Operation Timings............................................................................ 47

Erase And Programming Performance . . . . . . . . 48

Latchup Characteristics . . . . . . . . . . . . . . . . . . . . 48

TSOP Pin and Fine-Pitch BGA Capacitance. . . . 48

Data Retention . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . . . 49

FBD063—63-ball Fine-Pitch Ball Grid Array (FBGA 8 x 14 mm .........49

FBD048—Fine-Pitch Ball Grid Array, 6 x 12 mm .....................................50

TS 048—Thin Small Outline Package ........................................................... 51

Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . . 53

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相關代理商/技術參數	參數描述
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