- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄362161 > AH114-89G Watt, High Linearity InGaP HBT Amplifier PDF資料下載
參數(shù)資料
| 型號(hào)： | AH114-89G |
| 英文描述： | Watt, High Linearity InGaP HBT Amplifier |
| 中文描述： | 瓦，高線性InGaP HBT功率放大器 |
| 文件頁(yè)數(shù)： | 6/6頁(yè) |
| 文件大小： | 283K |
| 代理商： | AH114-89G |
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com
Page 6 of 6 November 2006
AH114
Watt, High Linearity InGaP HBT Amplifier
Product Information
The Communications Edge
TM
AH114-89G (Green / Lead-free SOT-89 Package) Mechanical Information
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260
C reflow temperature) and leaded
(maximum 245
C reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
Outline Drawing
Land Pattern
Thermal Specifications
Parameter
Operating Case Temperature
Thermal Resistance, Rth
(1)
Junction Temperature, Tj
(2)
Notes:
1. The thermal resistance is referenced from the junction-to-case at a case
temperature of 85
C.
2. This corresponds to the typical biasing condition of +5V, 150 mA at an 85
C case temperature. A minimum MTTF of 1 million hours is achieved
for junction temperatures below 247
C.
Rating
-40 to +85
C
149
C / W
197
C
Product Marking
The component will be marked with an
“
AH114
G
”
designator with an alphanumeric lo
t code on
the top surface of the package. The obsolete tin-
lead package is marked with an
“
AH114
”
or
“
E009
”
designator followed by an alphanumeric
lot code.
Tape and reel specifications for this part are
located on the website in the
“
Application
Notes
”
section.
ESD / MSL Information
ESD Rating: Class 1A
Test:
Standard:
MSL Rating: Level 3 at +260
C convection reflow
Standard: JEDEC Standard J-STD-020
Human Body Model (HBM)
JEDEC Standard JESD22-A114
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance of this
device. Vias should use a .35mm (#80 / .0135
”
) diameter drill and
have a final plated thru diameter of .25 mm (.010
”
).
2. Add as much copper as possible to inner and outer layers near the
part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the board to a
heatsink. Ensure that the ground / thermal via region contacts the
heatsink.
4. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in degrees.
MTTF vs. GND Tab Temperature
1.0
10.0
100.0
1000.0
60
70
80
90
100
110
120
Tab Temperature (
°C)
M
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| AH114-89PCB1900 | Watt, High Linearity InGaP HBT Amplifier |
| AH114-89PCB2140 | Watt, High Linearity InGaP HBT Amplifier |
| AH114-89PCB900 | Watt, High Linearity InGaP HBT Amplifier |
| AH116-RFID | 1/2 Watt, High Linearity InGaP HBT Amplifier |
| AH116-S8 | 1/2 Watt, High Linearity InGaP HBT Amplifier |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AH114-89PCB1900 | 功能描述:射頻開發(fā)工具 1900MHz Eval Brd 14.5dB Gain RoHS:否 制造商:Taiyo Yuden 產(chǎn)品:Wireless Modules 類型:Wireless Audio 工具用于評(píng)估:WYSAAVDX7 頻率: 工作電源電壓:3.4 V to 5.5 V |
| AH114-89PCB2140 | 功能描述:射頻開發(fā)工具 2140MHz Eval Brd 14dB Gain RoHS:否 制造商:Taiyo Yuden 產(chǎn)品:Wireless Modules 類型:Wireless Audio 工具用于評(píng)估:WYSAAVDX7 頻率: 工作電源電壓:3.4 V to 5.5 V |
| AH114-89PCB900 | 功能描述:射頻開發(fā)工具 900MHz Eval Brd 19dB Gain RoHS:否 制造商:Taiyo Yuden 產(chǎn)品:Wireless Modules 類型:Wireless Audio 工具用于評(píng)估:WYSAAVDX7 頻率: 工作電源電壓:3.4 V to 5.5 V |
| AH114-89TRG | 制造商:TriQuint Semiconductor 功能描述:RF & MW DRIVER AMPLIFIER |
| AH115 | 制造商:WJCI 制造商全稱:WJCI 功能描述: Watt, High Linearity InGaP HBT Amplifier |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。