2-58 Revision 16 Global Tree Timing Characteristics Global clock delays include the central rib delay," />
參數(shù)資料
型號: AGLP125V2-CSG281I
廠商: Microsemi SoC
文件頁數(shù): 105/134頁
文件大?。?/td> 0K
描述: IC FPGA IGLOO PLUS 125K 281-CSP
標準包裝: 184
系列: IGLOO PLUS
邏輯元件/單元數(shù): 3120
RAM 位總計: 36864
輸入/輸出數(shù): 212
門數(shù): 125000
電源電壓: 1.14 V ~ 1.575 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 85°C
封裝/外殼: 281-TFBGA,CSBGA
供應(yīng)商設(shè)備封裝: 281-CSP(10x10)
IGLOO PLUS DC and Switching Characteristics
2-58
Revision 16
Global Tree Timing Characteristics
Global clock delays include the central rib delay, the spine delay, and the row delay. Delays do not
include I/O input buffer clock delays, as these are I/O standard–dependent, and the clock may be driven
and conditioned internally by the CCC module. For more details on clock conditioning capabilities, refer
minimum and maximum global clock delays within each device. Minimum and maximum delays are
measured with minimum and maximum loading.
Timing Characteristics
1.5 V DC Core Voltage
Table 2-84 AGLP030 Global Resource
Commercial-Case Conditions: TJ = 70°C, VCC = 1.425 V
Parameter
Description
Std.
Units
Min.1
Max.2
tRCKL
Input Low Delay for Global Clock
1.21
1.42
ns
tRCKH
Input High Delay for Global Clock
1.23
1.49
ns
tRCKMPWH
Minimum Pulse Width High for Global Clock
1.18
ns
tRCKMPWL
Minimum Pulse Width Low for Global Clock
1.15
ns
tRCKSW
Maximum Skew for Global Clock
0.27
ns
Notes:
1. Value reflects minimum load. The delay is measured from the CCC output to the clock pin of a sequential element,
located in a lightly loaded row (single element is connected to the global net).
2. Value reflects maximum load. The delay is measured on the clock pin of the farthest sequential element, located in a fully
loaded row (all available flip-flops are connected to the global net in the row).
3. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
Table 2-85 AGLP060 Global Resource
Commercial-Case Conditions: TJ = 70°C, VCC = 1.425 V
Parameter
Description
Std.
Units
Min.1
Max.2
tRCKL
Input Low Delay for Global Clock
1.32
1.62
ns
tRCKH
Input High Delay for Global Clock
1.34
1.72
ns
tRCKMPWH
Minimum Pulse Width High for Global Clock
1.18
ns
tRCKMPWL
Minimum Pulse Width Low for Global Clock
1.15
ns
tRCKSW
Maximum Skew for Global Clock
0.38
ns
Notes:
1. Value reflects minimum load. The delay is measured from the CCC output to the clock pin of a sequential element,
located in a lightly loaded row (single element is connected to the global net).
2. Value reflects maximum load. The delay is measured on the clock pin of the farthest sequential element, located in a fully
loaded row (all available flip-flops are connected to the global net in the row).
3. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
相關(guān)PDF資料
PDF描述
AGLP125V2-CS281I IC FPGA IGLOO PLUS 125K 281-CSP
EP4CE15F17I8L IC CYCLONE IV FPGA 15K 256FBGA
EP4CE15F17I7 IC CYCLONE IV FPGA 15K 256FBGA
PCF8594C-2T/02,112 IC EEPROM 4KBIT 100KHZ 8SOIC
IDT71V124SA10PHG8 IC SRAM 1MBIT 10NS 32TSOP
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
AGLP125-V2CSG289 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:IGLOO PLUS Low-Power Flash FPGAs with FlashFreeze Technology
AGLP125V2-CSG289 功能描述:IC FPGA IGLOO PLUS 125K 289-CSP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:IGLOO PLUS 標準包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計:- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA,CSBGA 供應(yīng)商設(shè)備封裝:289-CSP(14x14)
AGLP125-V2CSG289ES 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:IGLOO PLUS Low-Power Flash FPGAs with FlashFreeze Technology
AGLP125-V2CSG289I 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:IGLOO PLUS Low-Power Flash FPGAs with FlashFreeze Technology
AGLP125V2-CSG289I 功能描述:IC FPGA IGLOO PLUS 125K 289-CSP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:IGLOO PLUS 標準包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA(17x17)