Revision 17 5-5 Revision / Version Changes Page Revision 9 (Mar2010) Product Brief Advance v0.9 Packaging Advance" />
參數(shù)資料
型號： AGLN010V2-QNG48
廠商： Microsemi SoC
文件頁數(shù)： 52/150頁
文件大小： 0K
描述： IC FPGA 10K 1.2-1.5V 48QFN
標準包裝： 260
系列： IGLOO nano
邏輯元件/單元數(shù)： 260
輸入/輸出數(shù)： 34
門數(shù)： 10000
電源電壓： 1.14 V ~ 1.575 V
安裝類型： 表面貼裝
工作溫度： -20°C ~ 70°C
封裝/外殼： 48-VFQFN 裸露焊盤
供應商設(shè)備封裝： 48-QFN（6x6）
其它名稱： 1100-1121
IGLOO nano Low Power Flash FPGAs
Revision 17
5-5
Revision / Version
Changes
Page
Revision 9 (Mar2010)
Product Brief Advance
v0.9
Packaging Advance
v0.8
All product tables and pin tables were updated to show clearly that AGLN030 is
available only in the Z feature grade at this time. The nano-Z feature grade
devices are designated with a Z at the end of the part number.
N/A
Revision 8 (Jan 2009)
The "Reprogrammable Flash Technology" section was revised to add "250 MHz
(1.5 V systems) and 160 MHz (1.2 V systems) System Performance."
Product Brief Advance
v0.8
The note for AGLN030 in the "IGLOO nano Devices" table and "I/Os Per
Package" table was revised to remove the statement regarding package
compatibility with lower density nano devices.
The "I/Os with Advanced I/O Standards" section was revised to add definitions for
hot-swap and cold-sparing.
Packaging Advance
v0.7
The "UC81", "CS81", "QN48", and "QN68" pin tables for AGLN030 are new.
The "CS81"pin table for AGLN060 is new.
The "CS81" and "VQ100" pin tables for AGLN060Z are new.
The "CS8" and "VQ100" pin tables for AGLN125Z are new.
The "CS81" and "VQ100" pin tables for AGLN250Z is new.
Revision 7 (Apr 2009)
Product Brief Advance
v0.7
DC and Switching
Characteristics
Advance v0.3
The –F speed grade is no longer offered for IGLOO nano devices and was
removed from the datasheet.
N/A
Revision 6 (Mar 2009)
Packaging Advance
v0.6
The "VQ100" pin table for AGLN030 is new.
Revision 5 (Feb 2009)
Packaging Advance
v0.5
The "100-Pin QFN" section was removed.
N/A
Revision 4 (Feb 2009)
The QN100 package was removed for all devices.
N/A
Product Brief Advance
v0.6
"IGLOO nano Devices" table was updated to change the maximum user I/Os for
AGLN030 from 81 to 77.
Revision 3 (Feb 2009)
Product Brief Advance
v0.5
The following table note was removed from "IGLOO nano Devices" table: "Six
chip (main) and three quadrant global networks are available for AGLN060 and
above."
The CS81 package was added for AGLN250 in the "IGLOO nano Products
Packaging Advance
v0.4
The "UC81" and "CS81" pin tables for AGLN020 are new.
The "CS81" pin table for AGLN250 is new.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
AGLN010V2-QNG48I 功能描述:IC FPGA NANO 1KB 10K 48-QFN RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:IGLOO nano 標準包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計:- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA，CSBGA 供應商設(shè)備封裝:289-CSP（14x14）
AGLN010V2-UCG36 功能描述:IC FPGA 10K 1.2-1.5V 36UCG RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:IGLOO nano 產(chǎn)品變化通告:XC4000(E,L) Discontinuation 01/April/2002 標準包裝:24 系列:XC4000E/X LAB/CLB數(shù):100 邏輯元件/單元數(shù):238 RAM 位總計:3200 輸入/輸出數(shù):80 門數(shù):3000 電源電壓:4.5 V ~ 5.5 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:120-BCBGA 供應商設(shè)備封裝:120-CPGA（34.55x34.55）
AGLN010V2-UCG36I 功能描述:IC FPGA NANO 1KB 10K 36-UCSP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:IGLOO nano 標準包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計:- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA，CSBGA 供應商設(shè)備封裝:289-CSP（14x14）
AGLN010V5-QNG48 功能描述:IC FPGA NANO 1KB 10K 48-QFN RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:IGLOO nano 標準包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計:- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA，CSBGA 供應商設(shè)備封裝:289-CSP（14x14）
AGLN010V5-QNG48I 功能描述:IC FPGA NANO 1KB 10K 48-QFN RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:IGLOO nano 標準包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計:- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA，CSBGA 供應商設(shè)備封裝:289-CSP（14x14）
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