Revision 13 2-49 3.3 V PCI, 3.3 V PCI-X Peripheral Component Interface for 3.3 V standard specifies support fo" />
參數(shù)資料
型號： AGLE600V5-FGG484
廠商： Microsemi SoC
文件頁數(shù)： 127/166頁
文件大?。?/td> 0K
描述： IC FPGA 1KB FLASH 600K 484-FBGA
標準包裝： 60
系列： IGLOOe
邏輯元件/單元數(shù)： 13824
RAM 位總計： 110592
輸入/輸出數(shù)： 270
門數(shù)： 600000
電源電壓： 1.425 V ~ 1.575 V
安裝類型： 表面貼裝
工作溫度： 0°C ~ 70°C
封裝/外殼： 484-BGA
供應商設備封裝： 484-FPBGA（23x23）
IGLOOe Low Power Flash FPGAs
Revision 13
2-49
3.3 V PCI, 3.3 V PCI-X
Peripheral Component Interface for 3.3 V standard specifies support for 33 MHz and 66 MHz PCI Bus
applications.
AC loadings are defined per the PCI/PCI-X specifications for the datapath; Microsemi loadings for enable
path characterization are described in Figure 2-12.
AC loadings are defined per PCI/PCI-X specifications for the datapath; Microsemi loading for tristate is
described in Table 2-70.
Table 2-69 Minimum and Maximum DC Input and Output Levels
3.3 V PCI/PCI-X
VIL
VIH
VOL
VOH
IOL IOH
IOSH
IOSL
IIL1 IIH2
Drive Strength
Min.
V
Max.
V
Min.,
V
Max.
V
Max.
V
Min.
VmA mA
Max.
mA3
Max.
mA3
A4 A4
Per PCI
specification
Per PCI curves
10
Notes:
1. IIL is the input leakage current per I/O pin over recommended operation conditions where –0.3 V < VIN < VIL.
2. IIH is the input leakage current per I/O pin over recommended operating conditions VIH < VIN < VCCI . Input current is
larger when operating outside recommended ranges.
3. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.
4. Currents are measured at 85°C junction temperature.
Figure 2-12 AC Loading
Test Point
Enable Path
R to VCCI for tLZ / tZL / tZLS
10 pF for tZH / tZHS / tZL / tZLS
10 pF for tHZ / tLZ
R to GND for tHZ / tZH / tZHS
R = 1 k
Test Point
Datapath
R = 25
R to VCCI for tDP (F)
R to GND for tDP (R)
Table 2-70 AC Waveforms, Measuring Points, and Capacitive Loads
Input Low (V)
Input High (V)
Measuring Point* (V)
VREF (typ.) (V)
CLOAD (pF)
0
3.3
0.285 * VCCI for tDP(R)
0.615 * VCCI for tDP(F)
–10
Note: *Measuring point = Vtrip. See Table 2-23 on page 2-23 for a complete table of trip points.
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相關代理商/技術參數(shù)
參數(shù)描述
AGLE600V5-FGG484I 功能描述:IC FPGA 1KB FLASH 600K 484-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:IGLOOe 產(chǎn)品培訓模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標準包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計:6635520 輸入/輸出數(shù):270 門數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應商設備封裝:484-FBGA（23x23）
AGLE600V5-FGG896 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:IGLOOe Low-Power Flash FPGAs with Flash Freeze Technology
AGLE600V5-FGG896ES 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:IGLOOe Low-Power Flash FPGAs with Flash Freeze Technology
AGLE600V5-FGG896I 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:IGLOOe Low-Power Flash FPGAs with Flash Freeze Technology
AGLE600V5-FGG896PP 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:IGLOOe Low-Power Flash FPGAs with Flash Freeze Technology
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