Revision 13 2-29 3.3 V PCI/PCI-X Per PCI/PCI-X specification 25 75 3.3 V GTL 20 mA
參數(shù)資料
型號(hào): AGLE600V5-FGG484
廠商: Microsemi SoC
文件頁數(shù): 105/166頁
文件大?。?/td> 0K
描述: IC FPGA 1KB FLASH 600K 484-FBGA
標(biāo)準(zhǔn)包裝: 60
系列: IGLOOe
邏輯元件/單元數(shù): 13824
RAM 位總計(jì): 110592
輸入/輸出數(shù): 270
門數(shù): 600000
電源電壓: 1.425 V ~ 1.575 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 70°C
封裝/外殼: 484-BGA
供應(yīng)商設(shè)備封裝: 484-FPBGA(23x23)
IGLOOe Low Power Flash FPGAs
Revision 13
2-29
3.3 V PCI/PCI-X
Per PCI/PCI-X
specification
25
75
3.3 V GTL
20 mA5
11
2.5 V GTL
20 mA5
14
3.3 V GTL+
35 mA
12
2.5 V GTL+
33 mA
15
HSTL (I)
8 mA
50
HSTL (II)
15 mA
25
SSTL2 (I)
15 mA
27
31
SSTL2 (II)
18 mA
13
15
SSTL3 (I)
14 mA
44
69
SSTL3 (II)
21 mA
18
32
Table 2-29 I/O Weak Pull-Up/Pull-Down Resistances
Minimum and Maximum Weak Pull-Up/Pull-Down Resistance Values
VCCI
R((WEAK PULL-UP)1
(
)
R(WEAK PULL-DOWN)2
(
)
Minimum
Maximum
Minimum
Maximum
3.3 V
10 k
45 k
10 k
45 k
3.3 V (wide range I/Os)
10 k
45 k
10 k
45 k
2.5 V
11 k
55 k
12 k
74 k
1.8 V
18 k
70 k
17 k
110 k
1.5 V
19 k
90 k
19 k
140 k
1.2 V
25 k
110 k
25 k
150 k
1.2 V (wide range I/Os)
19 k
110 k
19 k
150 k
Notes:
1. R(WEAK PULL-UP-MAX) = (VCCImax – VOHspec) / I(WEAK PULL-UP-MIN)
2. R(WEAK PULL-DOWN-MAX) = (VOLspec) / I(WEAK PULL-DOWN-MIN)
Table 2-28 I/O Output Buffer Maximum Resistances1 (continued)
Standard
Drive Strength
RPULL-DOWN ()2
RPULL-UP ()3
Notes:
1. These maximum values are provided for informational reasons only. Minimum output buffer resistance values depend
on VCCI, drive strength selection, temperature, and process. For board design considerations and detailed output buffer
resistances, use the corresponding IBIS models located on the Microsemi SoC Products Group website at
http://www.microsemi.com/soc/techdocs/models/ibis.html.
2. R(PULL-DOWN-MAX) = (VOLspec) / IOLspec
3. R(PULL-UP-MAX) = (VCCImax – VOHspec) / IOHspec
4. Applicable to IGLOOe V2 devices operating in the 1.2 V core range ONLY.
5. Output drive strength is below JEDEC specification.
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