參數(shù)資料
型號(hào): AGLE600V2-FGG256
廠商: Microsemi SoC
文件頁(yè)數(shù): 65/166頁(yè)
文件大?。?/td> 0K
描述: IC FPGA 1KB FLASH 600K 256-FBGA
標(biāo)準(zhǔn)包裝: 90
系列: IGLOOe
邏輯元件/單元數(shù): 13824
RAM 位總計(jì): 110592
輸入/輸出數(shù): 165
門數(shù): 600000
電源電壓: 1.14 V ~ 1.575 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 70°C
封裝/外殼: 256-LBGA
供應(yīng)商設(shè)備封裝: 256-FPBGA(17x17)
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)第58頁(yè)第59頁(yè)第60頁(yè)第61頁(yè)第62頁(yè)第63頁(yè)第64頁(yè)當(dāng)前第65頁(yè)第66頁(yè)第67頁(yè)第68頁(yè)第69頁(yè)第70頁(yè)第71頁(yè)第72頁(yè)第73頁(yè)第74頁(yè)第75頁(yè)第76頁(yè)第77頁(yè)第78頁(yè)第79頁(yè)第80頁(yè)第81頁(yè)第82頁(yè)第83頁(yè)第84頁(yè)第85頁(yè)第86頁(yè)第87頁(yè)第88頁(yè)第89頁(yè)第90頁(yè)第91頁(yè)第92頁(yè)第93頁(yè)第94頁(yè)第95頁(yè)第96頁(yè)第97頁(yè)第98頁(yè)第99頁(yè)第100頁(yè)第101頁(yè)第102頁(yè)第103頁(yè)第104頁(yè)第105頁(yè)第106頁(yè)第107頁(yè)第108頁(yè)第109頁(yè)第110頁(yè)第111頁(yè)第112頁(yè)第113頁(yè)第114頁(yè)第115頁(yè)第116頁(yè)第117頁(yè)第118頁(yè)第119頁(yè)第120頁(yè)第121頁(yè)第122頁(yè)第123頁(yè)第124頁(yè)第125頁(yè)第126頁(yè)第127頁(yè)第128頁(yè)第129頁(yè)第130頁(yè)第131頁(yè)第132頁(yè)第133頁(yè)第134頁(yè)第135頁(yè)第136頁(yè)第137頁(yè)第138頁(yè)第139頁(yè)第140頁(yè)第141頁(yè)第142頁(yè)第143頁(yè)第144頁(yè)第145頁(yè)第146頁(yè)第147頁(yè)第148頁(yè)第149頁(yè)第150頁(yè)第151頁(yè)第152頁(yè)第153頁(yè)第154頁(yè)第155頁(yè)第156頁(yè)第157頁(yè)第158頁(yè)第159頁(yè)第160頁(yè)第161頁(yè)第162頁(yè)第163頁(yè)第164頁(yè)第165頁(yè)第166頁(yè)
Revision 13
5-1
5 – Datasheet Information
List of Changes
The following table lists critical changes that were made in each revision of the IGLOOe datasheet.
Revision
Changes
Page
Revision 13
(December 2012)
The "IGLOOe Ordering Information" section has been updated to mention "Y" as "Blank"
mentioning "Device Does Not Include License to Implement IP Based on the
Cryptography Research, Inc. (CRI) Patent Portfolio" (SAR 43176).
Also added the missing heading ’Supply Voltage’ under V2.
CCC/PLL Specification referring the reader to SmartGen was revised to refer instead to
the online help associated with the core (SAR 42568).
Live at Power-Up (LAPU) has been replaced with ’Instant On’.
NA
Revision 12
(September 2012)
The "Security" section was modified to clarify that Microsemi does not support
read-back of programmed data.
Libero Integrated Design Environment (IDE) was changed to Libero System-on-Chip
(SoC) throughout the document (SAR 40272).
N/A
Revision 11
(August 2012)
The drive strength, IOL, and IOH value for 3.3 V GTL and 2.5 V GTL was changed from
25 mA to 20 mA in the following tables (SAR 37180):
Also added note stating "Output drive strength is below JEDEC specification." for Tables 2-
25, 2-26, and 2-28.
Additionally, the IOL and IOH values for 3.3 V GTL+ and 2.5 V GTL+ were corrected
from 51 to 35 (for 3.3 V GTL+) and from 40 to 33 (for 2.5 V GTL+) in table Table 2-21
(SAR 39713).
revised so that the maximum is 3.6 V for all listed values of VCCI (SAR 37183).
The following sentence was removed from the "VMVx I/O Supply Voltage (quiet)"
section in the "Pin Descriptions and Packaging" section: "Within the package, the VMV
plane is decoupled from the simultaneous switching noise originating from the output
buffer VCCI domain" and replaced with “Within the package, the VMV plane biases the
input stage of the I/Os in the I/O banks” (SAR 38318). The datasheet mentions that
"VMV pins must be connected to the corresponding VCCI pins" for an ESD
enhancement.
相關(guān)PDF資料
PDF描述
RMA50DTKI-S288 CONN EDGECARD 100POS .125 EXTEND
RMM36DTAN CONN EDGECARD 72POS R/A .156 SLD
RMM36DTAH CONN EDGECARD 72POS R/A .156 SLD
M1A3P1000-FG144I IC FPGA M1 1KB FLASH 1M 144FPGA
M1A3P1000-FGG144I IC FPGA M1 1KB FLASH 1M 144FPGA
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
AGLE600V2-FGG256I 功能描述:IC FPGA 1KB FLASH 600K 256-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:IGLOOe 產(chǎn)品培訓(xùn)模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標(biāo)準(zhǔn)包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計(jì):6635520 輸入/輸出數(shù):270 門數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FBGA(23x23)
AGLE600V2-FGG484 功能描述:IC FPGA IGLOOE 1.2-1.5V 484FPBG RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:IGLOOe 標(biāo)準(zhǔn)包裝:60 系列:XP LAB/CLB數(shù):- 邏輯元件/單元數(shù):10000 RAM 位總計(jì):221184 輸入/輸出數(shù):244 門數(shù):- 電源電壓:1.71 V ~ 3.465 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:388-BBGA 供應(yīng)商設(shè)備封裝:388-FPBGA(23x23) 其它名稱:220-1241
AGLE600V2-FGG484I 功能描述:IC FPGA 1KB FLASH 600K 484-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:IGLOOe 產(chǎn)品培訓(xùn)模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標(biāo)準(zhǔn)包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計(jì):6635520 輸入/輸出數(shù):270 門數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FBGA(23x23)
AGLE600V2-FGG896 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:IGLOOe Low-Power Flash FPGAs with Flash Freeze Technology
AGLE600V2-FGG896ES 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:IGLOOe Low-Power Flash FPGAs with Flash Freeze Technology