Fusion Family of Mixed Signal FPGAs
Revision 4
2-69
Timing Characteristics
Table 2-31 RAM4K9
Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V
Parameter
Description
–2
–1
Std. Units
tAS
Address setup time
0.25 0.28 0.33
ns
tAH
Address hold time
0.00 0.00 0.00
ns
tENS
REN, WEN setup time
0.14 0.16 0.19
ns
tENH
REN, WEN hold time
0.10 0.11
0.13
ns
tBKS
BLK setup time
0.23 0.27 0.31
ns
tBKH
BL hold time
0.02 0.02 0.02
ns
tDS
Input data (DIN) setup time
0.18 0.21 0.25
ns
tDH
Input data (DIN) hold time
0.00 0.00 0.00
ns
tCKQ1
Clock High to new data valid on DOUT (output retained, WMODE = 0)
1.79 2.03 2.39
ns
Clock High to new data valid on DOUT (flow-through, WMODE = 1)
2.36 2.68 3.15
ns
tCKQ2
Clock High to new data valid on DOUT (pipelined)
0.89 1.02 1.20
ns
tC2CWWH1
Address collision clk-to-clk delay for reliable write after write on same
address—Applicable to Rising Edge
0.30 0.26 0.23
ns
tC2CRWH1
Address collision clk-to-clk delay for reliable read access after write on
same address—Applicable to Opening Edge
0.45 0.38 0.34
ns
tC2CWRH1
Address collision clk-to-clk delay for reliable write access after read on
same address— Applicable to Opening Edge
0.49 0.42 0.37
ns
tRSTBQ
RESET Low to data out Low on DOUT (flow-through)
0.92 1.05 1.23
ns
RESET Low to Data Out Low on DOUT (pipelined)
0.92 1.05 1.23
ns
tREMRSTB
RESET removal
0.29 0.33 0.38
ns
tRECRSTB
RESET recovery
1.50 1.71 2.01
ns
tMPWRSTB
RESET minimum pulse width
0.21 0.24 0.29
ns
tCYC
Clock cycle time
3.23 3.68 4.32
ns
FMAX
Maximum frequency
310
272
231
MHz
Notes:
2. For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on page 3-9.