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參數(shù)資料
| 型號(hào)： | ADV3222ARZ |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 17/20頁 |
| 文件大小： | 0K |
| 描述： | IC MULTIPLEXER 4:1 16SOIC |
| 標(biāo)準(zhǔn)包裝： | 48 |
| 功能： | 多路復(fù)用器 |
| 電路： | 1 x 4:1 |
| 電壓電源： | 雙電源 |
| 電壓 - 電源，單路/雙路(±)： | ±5V |
| 電流 - 電源： | 7.5mA |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 16-SOIC（0.154"，3.90mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 16-SOIC |
| 包裝： | 管件 |
ADV3221/ADV3222
Rev. 0 | Page 6 of 20
ABSOLUTE MAXIMUM RATINGS
POWER DISSIPATION
Table 4.
Parameter
Rating
Supply Voltage (V+ V)
12 V
Analog Input Voltage
V to V+
Digital Input Voltage
0 V to V+
Output Voltage (Disabled Output)
(V+ 1 V) to (V + 1 V)
Output Short-Circuit Duration
Momentary
Output Short-Circuit Current
50 mA
Storage Temperature Range
65°C to +150°C
Operating Temperature Range
40°C to +85°C
Lead Temperature (Soldering, 10 sec)
300°C
Junction Temperature
150°C
The ADV3221/ADV3222 are operated with ±5 V supplies and
can drive loads down to 150 Ω, resulting in a wide range of
possible power dissipations. For this reason, extra care must
be taken to adjust the operating conditions based on ambient
temperature.
Packaged in a 16-lead narrow-body SOIC, the ADV3221 and
ADV3222 junction-to-ambient thermal impedance (θJA) is 81°C/W.
For long-term reliability, the maximum allowed junction tempera-
ture of the die, TJ, should not exceed 125°C. Temporarily exceeding
this limit may cause a shift in parametric performance due to a
change in stresses exerted on the die by the package. Figure 4
shows the range of the allowed internal die power dissipations
that meet these conditions over the 40°C to +85°C ambient
temperature range. When using Figure 4, do not include the
external load power in the maximum power calculation, but
do include the load current through the die output transistors.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
1.50
1.25
1.00
0.75
0.50
15
25
35
45
55
65
75
85
MA
XI
MU
M
P
O
W
E
R
(W
)
AMBIENT TEMPERATURE (°C)
TJ = 125°C
08
65
2-
0
04
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 5. Thermal Resistance
Package Type
θJA
θJC
Unit
16-Lead Narrow-Body SOIC
81
43
°C/W
Figure 4. Maximum Die Power Dissipation vs. Ambient Temperature
ESD CAUTION
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