
13
ADS823, ADS826
GROUNDING AND DECOUPLING
Proper grounding and bypassing, short lead length, and the
use of ground planes are particularly important for high
frequency designs. Multilayer PC boards are recommended
for best performance since they offer distinct advantages
like minimizing ground impedance, separation of signal
layers by ground layers, etc. The ADS823 and ADS826
should be treated as an analog component. Whenever pos-
sible, the supply pins should be powered by the analog
supply. This will ensure the most consistent results, since
digital supply lines often carry high levels of noise which
otherwise would be coupled into the converter and degrade
the achievable performance. All ground connections on the
ADS823 and ADS826 are internally joined together, obviat-
ing the design of split ground planes. The ground pins (1, 16,
26) should directly connect to an analog ground plane which
covers the PC board area around the converter. While
designing the layout, it is important to keep the analog signal
traces separated from any digital lines to prevent noise
coupling onto the analog signal path. Due to the high
sampling rate, the ADS823 and ADS826 generate high
frequency current transients and noise (clock feedthrough)
that are fed back into the supply and reference lines. This
requires that all supply and reference pins are sufficiently
bypassed. Figure 10 shows the recommended decoupling
scheme for the ADS823 and ADS826. In most cases 0.1
μ
F
ceramic chip capacitors at each pin are adequate to keep the
impedance low over a wide frequency range. Their effec-
tiveness largely depends on the proximity to the individual
supply pin. Therefore, they should be located as close to the
supply pins as possible. In addition, a larger bipolar capaci-
tor (1
μ
F to 22
μ
F) should be placed on the PC board in
proximity of the converter circuit.
FIGURE 10. Recommended Bypassing for the Supply Pins.
+V
S
27
26
GND
ADS823
ADS826
+V
S
15
+
0.1
μ
F
0.1
μ
F
16
GND
10
μ
F
+5V
VDRV
28
0.1
μ
F
+3/+5V