
3
ADS7831
BLOCK DIAGRAM
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes
no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change
without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant
any BURR-BROWN product for use in life support devices and/or systems.
ABSOLUTE MAXIMUM RATINGS
Analog Inputs: V
..............................................................................
±
25V
REF ..................................... +V
+0.3V to AGND2 –0.3V
CAP ...........................................Indefinite Short to AGND2
Momentary Short to +V
Ground Voltage Differences: DGND, AGND1, AGND2 ...................
±
0.3V
+V
ANA
....................................................................................................+7V
+V
DIG
to +V
...................................................................................+0.3V
+V
DIG
...................................................................................................... 7V
–V
.................................................................................................... –7V
Digital Inputs ............................................................. –0.3V to +V
+0.3V
Maximum Junction Temperature ................................................... +165
°
C
Internal Power Dissipation ............................................................. 825mW
Lead Temperature (soldering, 10s)................................................ +300
°
C
PACKAGE AND ORDERING INFORMATION
(1)
PACKAGE DRAWING
NUMBER
MODEL
PACKAGE
ADS7831P
ADS7831U
28-Pin Plastic DIP
28-Pin SOIC
246
217
NOTE: (1) For detailed drawing and dimension table, please see end of data
sheet, or Appendix D of Burr-Brown IC Data Book.
ELECTROSTATIC
DISCHARGE SENSITIVITY
Electrostatic discharge can cause damage ranging from
performance degradation to complete device failure. Burr-
Brown Corporation recommends that all integrated circuits be
handled and stored using appropriate ESD protection
methods.
CDAC
Internal
Ref
Output
Latches
and
Three
State
Drivers
Three
State
Parallel
Data
Bus
BUSY
±2.5V Input
2.5V Ref Out
Comparator
Buffer
2.5k
575
Successive Approximation Register and Control Logic
Clock
Cap
8.6k
4.8k
18k