參數(shù)資料
型號: ADS62P44IRGCRG4
廠商: Texas Instruments
文件頁數(shù): 64/78頁
文件大小: 0K
描述: IC ADC 14BIT SER/PAR 105M 64VQFN
產(chǎn)品培訓(xùn)模塊: Data Converter Basics
標(biāo)準(zhǔn)包裝: 2,000
位數(shù): 14
采樣率(每秒): 105M
數(shù)據(jù)接口: 串行,并聯(lián)
轉(zhuǎn)換器數(shù)目: 2
電壓電源: 模擬和數(shù)字
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 64-VFQFN 裸露焊盤
供應(yīng)商設(shè)備封裝: 64-VQFN 裸露焊盤(9x9)
包裝: 帶卷 (TR)
輸入數(shù)目和類型: 2 個差分,單極
SLAS561C
– JULY 2007 – REVISED FEBRUARY 2012
BOARD DESIGN CONSIDERATIONS
Grounding
A single ground plane is sufficient to give good performance, provided the analog, digital, and clock sections of
the board are cleanly partitioned. See the EVM User Guide (SLAU237) for details on layout and grounding.
Supply Decoupling
As the ADS62P4X already includes internal decoupling, minimal external decoupling can be used without loss in
performance. Note that decoupling capacitors can help filter external power supply noise, so the optimum
number of capacitors would depend on the actual application. The decoupling capacitors should be placed very
close to the converter supply pins.
It is recommended to use separate supplies for the analog and digital supply pins to isolate digital switching
noise from sensitive analog circuitry. In case only a single 3.3-V supply is available, it should be routed first to
AVDD. It can then be tapped and isolated with a ferrite bead (or inductor) with decoupling capacitor, before being
routed to DRVDD.
Exposed Thermal Pad
It is necessary to solder the exposed pad at the bottom of the package to a ground plane for best thermal
performance. For detailed information, see application notes QFN Layout Guidelines (SLOA122) and QFN/SON
PCB Attachment (SLUA271).
Copyright
2007–2012, Texas Instruments Incorporated
67
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