參數(shù)資料
型號(hào): ADP3410KRU
廠商: ANALOG DEVICES INC
元件分類: MOSFETs
英文描述: Dual MOSFET Driver with Bootstrapping
中文描述: 2 CHANNEL, HALF BRDG BASED MOSFET DRIVER, PDSO14
封裝: MO-153AB-1, TSSOP-14
文件頁(yè)數(shù): 8/11頁(yè)
文件大小: 148K
代理商: ADP3410KRU
REV. 0
ADP3410
–8–
THEORY OF OPERATION
The ADP3410 is a dual MOSFET driver optimized for driving
two N-channel FETs in a synchronous buck converter topology.
A single PWM input signal is all that is required to properly
drive the high-side and the low-side FETs. Each driver is
capable of driving a 3 nF load with only a 20 ns transition time.
A more detailed description of the ADP3410 and its features
follows. Refer to the functional block diagram.
Low-Side Driver
The low-side driver is designed to drive low-R
DS(ON)
N-channel
MOSFETs. The maximum output resistance for the driver is
5
s for both sourcing and sinking gate current. The low-output
resistance allows the driver to have 20 ns rise and fall times into
a 3 nF load. The bias to the low-side driver is internally con-
nected to the VCC supply and PGND.
When the driver is enabled, the driver’s output is 180
°
out of
phase with the PWM input. When the driver is shut down or the
entire ADP3410 is in shutdown or in under voltage lockout, the
low-side gate is held low.
High-Side Driver
The high-side driver is designed to drive a floating low R
DS(ON)
N-channel MOSFET. The maximum output resistance for the
driver is 5
s for both sourcing and sinking gate current. The
low output resistance allows the driver to have 20 ns rise and fall
times into a 3 nF load. The bias voltage for the high-side driver
is developed by an external bootstrap supply circuit, which is
connected between the BST and SW pins.
The bootstrap circuit comprises a Schottky diode, D1, and
bootstrap capacitor, C
BST
. When the ADP3410 is starting up,
the SW pin is at ground, so the bootstrap capacitor will charge
up to VCC
through D1. As the input voltage ramps up and
exceeds the UVLO threshold, the high-side driver is enabled.
When the PWM input goes high, the high-side driver will begin
to turn the high-side FET, Q1, ON by pulling charge out of
C
BST
. As Q1 turns ON, the SW pin will rise up to V
BATT
,
forcing the BST pin to V
BATT
+ V
C(BST)
, which is enough gate-
to-source voltage to hold Q1 ON. To complete the cycle, Q1 is
switched OFF by pulling the gate down to the voltage at the
SW pin. When the low-side FET, Q2, turns ON, the SW pin is
pulled to ground. This allows the bootstrap capacitor to charge
up to VCC
again.
The high-side driver’s output is in phase with the PWM input.
When the driver is in under-voltage lockout, the high-side gate
is held low.
Overlap Protection Circuit
The Overlap Protection Circuit (OPC) prevents both of the
main power switches, Q1 and Q2, from being ON at the same
time. This is done to prevent shoot-through currents from
flowing through both power switches and the associated losses
that can occur during their ON-OFF transitions. The overlap
protection circuit accomplishes this by adaptively controlling the
delay from Q1’s turn OFF to Q2’s turn ON, and by program-
ming the delay from Q2’s turn OFF to Q1’s turn ON.
To prevent the overlap of the gate drives during Q1’s turn OFF
and Q2’s turn ON, the overlap circuit monitors the voltage at
the SW pin. When the PWM input signal goes low, Q1 will
begin to turn OFF (after a propagation delay), but before Q2
can turn ON, the overlap protection circuit waits for the voltage
at the SW pin to fall from V
BATT
to 1 V. Once the voltage on the
SW pin has fallen to 1 V, Q2 will begin turn ON. By waiting for
the voltage on the SW pin to reach 1 V, the overlap protection
circuit ensures that Q1 is OFF before Q2 turns on, regardless of
variations in temperature, supply voltage, gate charge, and drive
current.
To prevent the overlap of the gate drives during Q2’s turn OFF
and Q1’s turn ON, the overlap circuit provides a programmable
delay that is set by a capacitor on the DLY pin. When the PWM
input signal goes high, Q2 will begin to turn OFF (after a propa-
gation delay), but before Q1 can turn ON, the overlap protection
circuit waits for the voltage at DRVL to drop to around 10% of
VCC. Once the voltage at DRVL has reached the 10% point,
the overlap protection circuit will wait for a 20 ns typical propa-
gation delay plus an additional delay based on the external
capacitor, C
DLY
. The delay capacitor adds an additional 1 ns/pF
of delay. Once the programmable delay period has expired, Q1
will begin turn ON. The delay allows time for current to com-
mutate from the body diode of Q2 to an external Schottky
diode, which allows turn-off losses to be reduced. Although not
as foolproof as the adaptive delay, the programmable delay adds
a safety margin to account for variations in size, gate charge, and
internal delay of the external power MOSFETs.
Overvoltage Protection
An overvoltage protection circuit monitors the output voltage
for an overvoltage condition. This condition is possible if Q1
should fail. If this should occur, the output voltage would begin
to rise up to the battery voltage where it would pose the threat
of damage to the devices connected to the output. By adding a
resistor divider, Ra and Rb, to the OVPSET pin, the output
voltage can be monitored for this fault condition.
If the voltage on the OVPSET pin exceeds the 1.2 V threshold,
this indicates a fault condition and Q1 is turned OFF and the
low-side FET (synchronous rectifier) is turned ON. The power
switches will remain in this state until the voltage on the
OVPSET pin falls below 400 mV. The turn-on of Q2 is not
delayed by monitoring the SW voltage, but the triggering of
OVP is intentionally slow to avoid false triggering.
Low-Side Driver Enable
The low-side driver enable (
DRVLSD
) allows external control
of the synchronous rectifier. This is particularly useful for main-
taining efficiency under light load conditions. At light loads, the
PWM duty cycle becomes small, meaning the high-side switch is
ON for a very short time and the synchronous rectifier is ON for
the remainder of the period. Under these conditions, the induc-
tor current ramps up during the short high-side switch ON time,
and then ramps down during the synchronous rectifier’s ON
time. If the inductor current reaches zero and there is still time
left in the period, the inductor current will begin to go negative.
Negative current indicates that current is being drawn out of the
output capacitor through the inductor and low-side FET to
ground, incurring extra losses in the process. If the
DRVLSD
is
used to shut down the low-side driver when the inductor
current reaches zero, the light load efficiency can be dramatically
improved. If inductor current information is not available, but
a microprocessor is performing a power management function,
it can shut down the synchronous rectifier when in a sleep or
stand-by mode.
When the
DRVLSD
input is low, the low-side driver output
goes low. When the
DRVLSD
input is high the low-side driver
is enabled and controlled by the PWM input. The propagation
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