參數(shù)資料
型號: ADL5375-15ACPZ-R7
廠商: ANALOG DEVICES INC
元件分類: 調(diào)制器/解調(diào)器
英文描述: 400 MHz - 6000 MHz RF/MICROWAVE I/Q MODULATOR
封裝: 4 X 4 MM, ROHS COMPLIANT, MO-220-VGGD-8, LFCSP-24
文件頁數(shù): 21/32頁
文件大?。?/td> 1247K
代理商: ADL5375-15ACPZ-R7
ADL5375
Rev. A | Page 28 of 32
P
ing
Toh
0
705
2-
0
48
Figure 71. Evaluation Board Layout, Top Layer
070
52-
051
Figure 72. Evaluation Board Layout, Bottom Layer
THERMAL GROUNDING AND EVALUATION
BOARD LAYOUT
The package for the ADL5375 features an exposed paddle on
the underside that should be well soldered to a low thermal
and electrical impedance ground plane. This paddle is typically
soldered to an exposed opening in the solder mask on the
evaluation board. Figure 73 illustrates the dimensions used
in the layout of the ADL5735 footprint on the ADL5375
evaluation board (1 mil. = 0.0254 mm).
Notice the use of nine via holes on the exposed paddle. These
ground vias should be connected to all other ground layers on
the evaluation board to maximize heat dissipation from the
device package.
07
05
2-
0
46
82 mil.
12 mil.
23 mil.
133.8 mil.
98.4 mil.
19.7 mil.
25 mil.
Figure 73. Dimensions for Evaluation Board Layout for the ADL5375 Package
Under these conditions, the thermal impedance of the ADL5375
was measured to be approximately 30°C/W in still air.
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