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參數(shù)資料
| 型號(hào)： | ADG819BRM |
| 廠商： | ANALOG DEVICES INC |
| 元件分類： | 運(yùn)動(dòng)控制電子 |
| 英文描述： | REC3-SR_DR/H1 Series - Econoline Regulated DC-DC Converters; Input Voltage (Vdc): 05V; Output Voltage (Vdc): 15V; Power: 3W; Low Cost 3W converter in DIP24 Package; 1kVDC Isolation; Regulated Output; UL Approved; Continuous Short Circuit Protection; Internal SMD design; 3 Pinout Options, 3 Case Styles.; Efficiency to 75% |
| 中文描述： | 1-CHANNEL, SGL POLE DOUBLE THROW SWITCH, PDSO8 |
| 封裝： | MICRO, SOIC-8 |
| 文件頁數(shù)： | 4/12頁 |
| 文件大?。?/td> | 195K |
| 代理商： | ADG819BRM |
REV. 0
ADG819/ADG820
–4–
ABSOLUTE MAXIMUM RATINGS
1
(T
A
= 25
°
C, unless otherwise noted.)
V
DD
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
Analog Inputs
2
. . . . . . . . . . . . . . . . . –0.3 V to V
DD
+ 0.3 V or
. . . . . . . . . . . . . . . . . . . . . . . 30 mA, Whichever Occurs First
Digital Inputs
2
. . . . . . . . . . . . . . . . . –0.3 V to V
DD
+ 0.3 V or
. . . . . . . . . . . . . . . . . . . . . . . 30 mA, Whichever Occurs First
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . 400 mA
. . . . . . . . . . . . . . . . (Pulsed at 1 ms, 10% Duty Cycle Max)
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . 200 mA
Operating Temperature Range
Industrial . . . . . . . . . . . . . . . . . . . . . . . . . . . –40
°
C to +85
°
C
Automotive . . . . . . . . . . . . . . . . . . . . . . . . –40
°
C to +125
°
C
Storage Temperature Range . . . . . . . . . . . . –65
°
C to +150
°
C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . 150
°
C
μ
SOIC Package
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 206
°
C/W
JC
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 44
°
C/W
SOT-23 Package (4-Layer Board)
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 119
°
C/W
MicroCSP Package
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . . . TBD
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . . 300
°
C
IR Reflow, Peak Temperature (<20 sec) . . . . . . . . . . . 235
°
C
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.
2
Overvoltages at IN, S, or D will be clamped by internal diodes. Current should be
limited to the maximum ratings given.
Table I. Truth Table for the ADG819/ADG820
IN
Switch S1
Switch S2
0
1
ON
OFF
OFF
ON
PIN CONFIGURATIONS
6-Lead SOT-23
(RT-6)
TOP VIEW
(Not to Scale)
6
5
4
1
2
3
IN
S2
ADG819/
ADG820
V
DD
GND
D
S1
8-Lead
μ
SOIC
(RM-8)
TOP VIEW
(Not to Scale)
8
7
6
5
1
2
3
4
NC = NO CONNECT
D
S2
ADG819/
ADG820
S1
V
DD
GND
NC
IN
NC
2 3 MicroCSP
S2
1
IN
6
S1
3
V
DD
5
D
2
GND
4
ADG819 ONLY
TOP VIEW
(BUMPS AT THE BOTTOM)
NOT TO SCALE
ORDERING GUIDE
Model Option
Temperature Range
–40
°
C to +125
°
C
–40
°
C to +125
°
C
–40
°
C to +85
°
C
–40
°
C to +125
°
C
–40
°
C to +125
°
C
Brand
1
Package Description
μ
SOIC (MicroSmall Outline IC)
SOT-23 (Plastic Surface-Mount)
MicroCSP (Micro Chip Scale Package)
μ
SOIC (MicroSmall Outline IC)
SOT-23 (Plastic Surface-Mount)
Package
ADG819BRM
ADG819BRT
ADG819BCB
ADG820BRM
ADG820BRT
SNB
SNB
SNB
SPB
SPB
RM-8
RT-6
2
CB-6
2
RM-8
RT-6
2
NOTES
1
Branding on these packages is limited to three characters due to space constraints.
2
Contact factory for availability.
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