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參數(shù)資料
| 型號(hào)： | ADG708BRU |
| 廠商： | Analog Devices Inc |
| 文件頁(yè)數(shù)： | 10/20頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | IC MULTIPLEXER 8X1 16TSSOP |
| 產(chǎn)品培訓(xùn)模塊： | Switch Fundamentals |
| 標(biāo)準(zhǔn)包裝： | 96 |
| 功能： | 多路復(fù)用器 |
| 電路： | 1 x 8:1 |
| 導(dǎo)通狀態(tài)電阻： | 4.5 歐姆 |
| 電壓電源： | 單/雙電源 |
| 電壓 - 電源，單路/雙路(±)： | 1.8 V ~ 5.5 V，±2.5 V |
| 電流 - 電源： | 1nA |
| 工作溫度： | -40°C ~ 125°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 16-TSSOP（0.173"，4.40mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 16-TSSOP |
| 包裝： | 管件 |
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ADG708/ADG709
Data Sheet
Rev. D | Page 18 of 20
TERMINOLOGY
VDD
Most positive power supply potential.
VSS
Most negative power supply in a dual-supply application. In
single-supply applications, tie VSS to ground at the device.
GND
Ground (0 V) reference.
S
Source terminal. Can be an input or output.
D
Drain terminal. Can be an input or output.
Ax
Logic control input.
EN
Active high enable.
RON
Ohmic resistance between D and S.
RFLAT (ON)
Flatness is defined as the difference between the maximum and
minimum value of on resistance as measured over the specified
analog signal range.
IS (Off)
Source leakage current with the switch off.
ID (Off)
Drain leakage current with the switch off.
ID, IS (On)
Channel leakage current with the switch on.
VD (VS)
Analog voltage on Terminal D and Terminal S.
CS (Off)
Off switch source capacitance. Measured with reference to ground.
CD (Off)
Off switch drain capacitance. Measured with reference to ground.
CD, CS (On)
On switch capacitance. Measured with reference to ground.
CIN
Digital input capacitance.
tTRANSITION
Delay time measured between the 50% and 90% points of the
digital inputs and the switch on condition when switching from
one address state to another.
tON (EN)
Delay time between the 50% and 90% points of the EN digital
input and the switch on condition.
tOFF (EN)
Delay time between the 50% and 90% points of the EN digital
input and the switch off condition.
tOPEN
Off time measured between the 80% points of both switches
when switching from one address state to another.
Off Isolation
A measure of unwanted signal coupling through an off switch.
Crosstalk
A measure of unwanted signal that is coupled through from one
channel to another as a result of parasitic capacitance.
Charge
A measure of the glitch impulse transferred from injection of
the digital input to the analog output during switching.
Bandwidth
The frequency at which the output is attenuated by 3 dB.
On Response
The frequency response of the on switch.
On Loss
The loss due to the on resistance of the switch.
VINL
Maximum input voltage for Logic 0.
VINH
Minimum input voltage for Logic 1.
IINL (IINH)
Input current of the digital input.
IDD
Positive supply current.
ISS
Negative supply current.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ADG708BRU | 制造商:Analog Devices 功能描述:SEMICONDUCTOR ((NW)) |
| ADG708BRU-REEL | 功能描述:IC MULTIPLEXER 8X1 16TSSOP RoHS:否 類別:集成電路 (IC) >> 接口 - 模擬開關(guān)，多路復(fù)用器，多路分解器 系列:- 標(biāo)準(zhǔn)包裝:1,000 系列:- 功能:多路復(fù)用器 電路:1 x 4:1 導(dǎo)通狀態(tài)電阻:- 電壓電源:雙電源 電壓 - 電源，單路/雙路(±):±5V 電流 - 電源:7mA 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:16-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:16-SOIC 包裝:帶卷 (TR) |
| ADG708BRU-REEL7 | 功能描述:IC MULTIPLEXER 8X1 16TSSOP RoHS:否 類別:集成電路 (IC) >> 接口 - 模擬開關(guān)，多路復(fù)用器，多路分解器 系列:- 標(biāo)準(zhǔn)包裝:1,000 系列:- 功能:多路復(fù)用器 電路:1 x 4:1 導(dǎo)通狀態(tài)電阻:- 電壓電源:雙電源 電壓 - 電源，單路/雙路(±):±5V 電流 - 電源:7mA 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:16-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:16-SOIC 包裝:帶卷 (TR) |
| ADG708BRUZ | 功能描述:IC MULTIPLEXER 8X1 16TSSOP RoHS:是 類別:集成電路 (IC) >> 接口 - 模擬開關(guān)，多路復(fù)用器，多路分解器 系列:- 特色產(chǎn)品:MicroPak? 標(biāo)準(zhǔn)包裝:1 系列:- 功能:開關(guān) 電路:2 x SPST - NC 導(dǎo)通狀態(tài)電阻:500 毫歐 電壓電源:單電源 電壓 - 電源，單路/雙路(±):1.4 V ~ 4.3 V 電流 - 電源:150nA 工作溫度:-40°C ~ 125°C 安裝類型:表面貼裝 封裝/外殼:8-XFDFN 供應(yīng)商設(shè)備封裝:8-XSON，SOT833-1 （1.95x1） 包裝:Digi-Reel® 其它名稱:568-5557-6 |
| ADG708BRUZ-REEL | 功能描述:IC MULTIPLEXER 8X1 16TSSOP RoHS:是 類別:集成電路 (IC) >> 接口 - 模擬開關(guān)，多路復(fù)用器，多路分解器 系列:- 標(biāo)準(zhǔn)包裝:1,000 系列:- 功能:多路復(fù)用器 電路:1 x 4:1 導(dǎo)通狀態(tài)電阻:- 電壓電源:雙電源 電壓 - 電源，單路/雙路(±):±5V 電流 - 電源:7mA 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:16-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:16-SOIC 包裝:帶卷 (TR) |
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