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ADG1438/ADG1439
Rev. A | Page 10 of 20
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 8.
Parameter
Rating
VDD to VSS
35 V
VDD to GND
0.3 V to +25 V
VSS to GND
+0.3 V to 25 V
VL to GND
0.3 V to +7 V
VSS 0.3 V to VDD + 0.3 V or
30 mA, whichever occurs first
GND 0.3 V to VL + 0.3 V or
30 mA, whichever occurs first
Continuous Current, Sx or
Dx Pins
tions + 15%
Peak Current, Sx or Dx Pins
(Pulsed at 1 ms, 10% Duty
Cycle Max)
TSSOP
300 mA
LFCSP
400 mA
Operating Temperature Range
Industrial (B Version)
40°C to +125°C
Storage Temperature Range
65°C to +150°C
Junction Temperature
150°C
Reflow Soldering Peak
Temperature (Pb-Free)
260(+0/5)°C
Time at Peak Temperature
10 sec to 40 sec
1 Overvoltages at the analog and digital inputs are clamped by internal
diodes. Current should be limited to the maximum ratings given.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Only one absolute maximum rating can be applied at any one time.
THERMAL RESISTANCE
Table 9. Thermal Resistance
Package Type
θJA
θJC
Unit
20 Lead TSSOP (4-Layer Board)
112.6
50
°C/W
20-Lead LFCSP (4-Layer Board and
Exposed Paddle Soldered to VSS)
30.4
N/A
°C/W
ESD CAUTION