ADG1408/ADG1409
Rev. B | Page 9 of 20
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 6.
Parameter
Rating
VDD to VSS
35 V
VDD to GND
0.3 V to +25 V
VSS to GND
+0.3 V to 25 V
Analog Inputs, Digital In
puts1VSS 0.3 V to VDD + 0.3 V
or 30 mA, whichever
occurs first
Continuous Current, S or D
Peak Current, S or D (Pulsed at 1 ms,
10% Duty Cycle Maximum)
350 mA
Operating Temperature Range
Industrial (Y Version)
40°C to +125°C
Storage Temperature Range
65°C to +150°C
Junction Temperature
150°C
Reflow Soldering Peak Temperature
(Pb-Free)
260(+0/5)°C
1 Overvoltages at A, EN, S, or D are clamped by internal diodes. Current should
be limited to the maximum ratings given.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Only one absolute maximum rating can be applied at any
one time.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 7. Thermal Resistance
Package Type
θJA
θJC
Unit
16-Lead TSSOP
150.4
50
°C/W
16-Lead LFCSP
30.4
°C/W
ESD CAUTION