參數(shù)資料
型號: ADF4212LBRUZ-RL
廠商: Analog Devices Inc
文件頁數(shù): 12/28頁
文件大?。?/td> 0K
描述: IC PLL FREQ SYNTHESIZER 20TSSOP
標(biāo)準(zhǔn)包裝: 2,500
類型: 時鐘/頻率合成器(RF/IF)
PLL:
輸入: CMOS,TTL
輸出: 時鐘
電路數(shù): 1
比率 - 輸入:輸出: 3:1
差分 - 輸入:輸出: 是/是
頻率 - 最大: 2.4GHz
除法器/乘法器: 是/無
電源電壓: 2.7 V ~ 3.3 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 20-TSSOP(0.173",4.40mm 寬)
供應(yīng)商設(shè)備封裝: 20-TSSOP
包裝: 帶卷 (TR)
ADF4212L
Data Sheet
Rev. E | Page 2 of 28
TABLE OF CONTENTS
REVISION HISTORY
1/14—Rev. D to Rev. E
Changes to Table 10........................................................................ 18
8/12—Rev. C to Rev D
Changed CP-20-1 to CP-20-6 ...........................................Universal
Updated Outline Dimensions ....................................................... 25
Changes to Ordering Guide .......................................................... 26
11/10—Rev. B to Rev C
Changes to VP1, VP2 to GND Parameter, Table 4 and VP1, VP2
to VDD1, VDD2 Parameter, Table 4 ................................................... 6
Changes to Ordering Guide .......................................................... 26
9/08—Rev. A to Rev B
Updated Format..................................................................Universal
Changes to Figure 1 and General Description Section ............... 1
Changes to Prescaler Output Frequency Parameter and RF
Input Frequency (RFIN) Parameter................................................. 3
Changes to Table 3 and Figure 2..................................................... 5
Changes to Figure 4.......................................................................... 7
Changes to Figure 27, RF/IF A and B Counters Section, Pulse
Swallow Function Section, and RF/IF R Counter Section........ 13
Changes to RF/IF Input Shift Register Section........................... 14
Changes to Programmable IF Reference (R) Counter Section,
IF Program Modes Section, and IF Power-Down Section........ 20
Changes to Programmable RF Reference (R) Counter Section,
RF Program Modes Section, Programmable RF N Counter
Section, and RF Power-Down Section......................................... 21
Changes to Figure 32...................................................................... 23
Changes to Figure 33 and Figure 34............................................. 24
Added PCB Design Guidelines for Lead Frame Chip Scale
Package Section............................................................................... 24
Updated Outline Dimensions....................................................... 25
Changes to Ordering Guide.......................................................... 25
3/03—Data Sheet changed from REV. 0 to REV. A
Changes to General Description .....................................................1
Changes to Specifications.................................................................3
Changes to Table 9.......................................................................... 18
Changes to Table 11 ....................................................................... 20
Changes to Figure 31...................................................................... 23
11/02—Revision 0: Initial Version
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