VCC
參數(shù)資料
型號(hào): ADCLK948BCPZ
廠商: Analog Devices Inc
文件頁數(shù): 8/12頁
文件大?。?/td> 0K
描述: IC CLOCK BUFFER MUX 2:8 32-LFCSP
標(biāo)準(zhǔn)包裝: 1
系列: SIGe
類型: 扇出緩沖器(分配),多路復(fù)用器
電路數(shù): 1
比率 - 輸入:輸出: 2:8
差分 - 輸入:輸出: 是/是
輸入: CML,CMOS,LVDS,LVPECL
輸出: LVPECL
頻率 - 最大: 4.8GHz
電源電壓: 2.97 V ~ 3.63 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 32-VFQFN 裸露焊盤,CSP
供應(yīng)商設(shè)備封裝: 32-LFCSP-VQ
包裝: 管件
其它名稱: Q4996157
ADCLK948
Rev. A | Page 5 of 12
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
Rating
Supply Voltage
VCC VEE
6 V
Input Voltage
CLK0, CLK1, CLK0, CLK1, IN_SEL
VEE 0.5 V to
VCC + 0.5 V
CLK0, CLK1, CLK0, CLK1 to VTx Pin (CML,
LVPECL Termination)
±40 mA
CLK0, CLK1 to CLK0, CLK1
±1.8 V
Input Termination, VTx to CLK0, CLK1, CLK0,
and CLK1
±2 V
Maximum Voltage on Output Pins
VCC + 0.5 V
Maximum Output Current
35 mA
Voltage Reference (VREFx)
VCC to VEE
Operating Temperature Range
Ambient
40°C to +85°C
Junction
150°C
Storage Temperature Range
65°C to +150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
DETERMINING JUNCTION TEMPERATURE
To determine the junction temperature on the application
printed circuit board (PCB), use the following equation:
TJ = TCASE + (ΨJT × PD)
where:
TJ is the junction temperature (°C).
TCASE is the case temperature (°C) measured by the customer at
the top center of the package.
ΨJT is from Table 6.
PD is the power dissipation.
Values of
θJA are provided for package comparison and PCB
design considerations.
θJA can be used for a first-order approxi-
mation of TJ by the equation
TJ = TA + (
θJA × PD)
where
TA is the ambient temperature (°C).
Values of
θJB are provided in Table 6 for package comparison
and PCB design considerations.
ESD CAUTION
THERMAL PERFORMANCE
Table 6.
Parameter
Symbol
Description
Value1
Unit
Junction-to-Ambient Thermal Resistance
θJA
Still Air
Per JEDEC JESD51-2
0 m/sec Air Flow
49.8
°C/W
Moving Air
θJMA
Per JEDEC JESD51-6
1 m/sec Air Flow
43.5
°C/W
2.5 m/sec Air Flow
39.0
°C/W
Junction-to-Board Thermal Resistance
θJB
Moving Air
Per JEDEC JESD51-8
1 m/sec Air Flow
30.7
°C/W
Junction-to-Case Thermal Resistance
θJC
Moving Air
Per MIL-STD 883, Method 1012.1
Die-to-Heatsink
8.8
°C/W
Junction-to-Top-of-Package Characterization Parameter
ΨJT
Still Air
Per JEDEC JESD51-2
0 m/sec Air Flow
0.7
°C/W
1 Results are from simulations. The PCB is a JEDEC multilayer type. Thermal performance for actual applications requires careful inspection of the conditions in the
application to determine if they are similar to those assumed in these calculations.
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